Senior Customer Package Design Integration Engineer (2.5D / 3D Packaging)

Rapidus Corporation US; Santa Clara (CA); On-site; USD 140,000 - 230,000; Full time

Benefits offered by this job

Health, Dental and Vision coverage

Job summary

Rapidus Corporation seeks a Customer Package Design Integration Engineer to drive the execution of chiplet-based product development using Rapidus advanced packaging technologies. You will serve as the primary technical and program interface between Rapidus and customers, integrating ADKs, packaging technologies, and customer design activities into a unified outcome.

You will combine deep expertise in 2.5D/3D packaging and chiplet integration with strong program management and cross-functional

Qualifications

• B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
• 5+ years of experience in semiconductor packaging, system design, or customer-facing engineering roles.
• Strong understanding of 2.5D / 3D packaging (interposer, TSV, hybrid bonding, RDL/fan-out).
• High-speed interfaces (HBM, PCIe, UCIe, SerDes).
• Hands-on experience with package design and analysis tools (Cadence, Ansys, Synopsys, etc.)
• Proven ability to manage complex technical programs and cross-functional activities
• Strong communication skills with customer-facing experience

Responsibilities

• Guide customers in effectively applying package design rules, libraries, and interface definitions.
• Interposer and substrate architectures; provide technical guidance on chiplet integration including HBM, UCIe, PCIe, and high-speed SerDes.
• Drive customer projects toward successful 2.5D/3D package design tape-out and product realization.
• Manage design schedules and milestones, risks, issues, and dependencies, cross-functional action items.
• Lead regular technical and program reviews with customers and internal teams.
• Act as the central coordination point across customer engineering teams, ADK / Enablement teams, process, manufacturing, and OSAT partners.

Job description

We are seeking a highly capable Customer Package Design Integration Engineer (2.5D / 3D Packaging) to ensure the successful execution of customer chiplet-based product development using Rapidus advanced packaging technologies.

This role serves as the primary technical and program interface between Rapidus and customers, integrating ADKs (Assembly Design Kits), packaging technologies, and customer design activities into a unified, successful outcome.

You will combine deep expertise in 2.5D/3D packaging and chiplet integration with strong program management and cross-functional coordination skills to drive customer designs from bring-up through tape-out in a rapidly evolving technology environment.

Locations: Albany, NY (USA) / Santa Clara, CA (USA) / Tokyo (Japan) / Chitose (Japan)

Employment Type: Full-time

Department: Design Enablement / Advanced Packaging Technology

About Rapidus

Rapidus Corporation, founded in 2022, is Japan-led initiative to build a world-class advanced logic semiconductor foundry. With a bold vision to accelerate innovation, we are pioneering cutting-edge logic semiconductor research, development, design, and manufacturing to transform the global semiconductor industry.

Why Join Us

You will play a central leadership role in building the world’s most advanced 2nm and next‑generation enablement ecosystem, shaping the foundation for future semiconductor innovation.

You will focus on the implementation stages (Synthesis and PnR) of the digital reference flow. Additionally, you will lead the adoption of next-generation automation tools, including AI/ML-driven DSE (Design space exploration)

Key Responsibilities

Customer Design Integration & Enablement

• Guide customers in effectively applying:
• Package design rules, libraries, and interface definitions
• Interposer and substrate architectures
• Provide technical guidance on chiplet integration, including HBM, UCIe, PCIe, and high-speed SerDes

Program Execution & Delivery Ownership

• Drive customer projects toward successful 2.5D/3D package design tape-out and product realization:
• Manage:
• Design schedules and milestones
• Risks, issues, and dependencies
• Cross-functional action items
• Lead regular technical and program reviews with customers and internal teams

Cross-functional Integration (Core Responsibility)

• Act as the central coordination point across:
• Customer engineering teams
• ADK / Enablement teams
• Process, manufacturing, and OSAT partners
• Translate Rapidus technology updates into clear, actionable guidance for customers
• Ensure alignment between design assumptions and manufacturing capabilities

Technical Issue Resolution

• Support debugging and issue resolution in areas such as:
• SI/PI and signal integrity challenges
• Package layout and routing issues
• ADK usage and interpretation
• Drive root-cause analysis and coordinate solution deployment across teams
• Capture customer feedback and drive improvements in:
• ADK quality and usability
• Design methodologies and flows
• Documentation and training materials
• Contribute to strengthening the chiplet ecosystem and customer readiness

Required Qualifications

• B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science, or related field
• 5+ years of experience in semiconductor packaging, system design, or customer-facing engineering roles
• Strong understanding of:
• 2.5D / 3D packaging (interposer, TSV, hybrid bonding, RDL/fan-out)
• High-speed interfaces (HBM, PCIe, UCIe, SerDes)
• Hands-on experience with package design and analysis tools (Cadence, Ansys, Synopsys, etc.)
• Proven ability to manage complex technical programs and cross-functional activities
• Strong communication skills with customer-facing experience

Preferred Qualifications

• Experience in foundry, OSAT, or semiconductor customer support roles
• Familiarity with ADK / PDK and design enablement flows
• Experience with die-package-system co-design methodologies
• Background in HPC, AI, or networking systems
• Experience in silicon bring-up, validation, or failure analysis
• Knowledge of advanced substrates (ABF, glass core, fan-out RDL)
• Japanese language skills for collaboration with Japan-based customers

What You Will Impact

• Ensure successful customer design execution and tape-out delivery
• Bridge the gap between ADK (Assembly Design Kit: design environment) and real product realization
• Integrate design, technology, and execution into a coherent development flow
• Accelerate customer adoption of Rapidus advanced packaging technologies at 2nm and beyond

What We Offer

• Opportunity to play a critical role in customer success for next-generation chiplet platforms
• Work at the intersection of technology, execution, and system integration
• Collaboration with global teams across the US and Japan
• Competitive compensation and career growth opportunities
• Comprehensive Health, Dental and Vision coverage, fully at company's expense (no deductibles)