Lead 2.5D/3D Advanced Packaging Engineer

Jobtailor; California (MO); On-site; USD 120,000 - 180,000; Full time

Job summary

Jobtailor, a leader in advanced packaging, seeks a senior engineer to drive 2.5D/3D development across diverse programs. You will collaborate with design, marketing, NPI, assembly, and suppliers to deliver cost-effective, high-performance packaging solutions that meet SI, thermal and reliability requirements.

This role requires hands-on experience with 2.5D/3D packaging, substrates, interposers, bumping and wafer-level processes, plus strong project management and global collaboration skills.

Qualifications

• Master's or PhD with strong background in advanced packaging and chip interconnects.
• Experience delivering cost-effective, high-performance 2.5D/3D packaging solutions.
• Knowledge of substrates, interposers, bumping and wafer-level packaging.
• Familiarity with design rules, assembly processes and failure analysis tools.
• Ability to manage cross-functional programs and supplier engagements.

Responsibilities

• Develop cost-effective, high-performance advanced packaging solutions.
• Collaborate with silicon/package design, marketing, NPI, assembly and suppliers.
• Ensure designs meet signal integrity, thermal, structural reliability and schedules.
• Provide expertise in 2.5D / 3D technology for customers.
• Consolidate requirements towards unified solutions.
• Lead development and qualification programs with external partners.
• Engage memory suppliers to define tech and quality requirements.
• Interface with DI, package design and test teams as a cross-functional unit.
• Support new design wins, NPI and volume ramps.
• Develop alternate sourcing and qualification strategies.
• Translate concepts into structured projects and innovative solutions.
• Manage multiple programs concurrently.

Skills

2.5D / 3D development

Advanced packaging solutions

Project management

Thermal modelling

Silicon fabrication knowledge

Communication skills

Education

Master's Degree in Mechanical / Electrical / Electronics Engineering

PhD with relevant experience

Tools

APD

AutoCAD

Solidworks

Job description

Jobtailor, a leader in advanced packaging, seeks a senior engineer to drive 2.5D/3D development across diverse programs. You will collaborate with design, marketing, NPI, assembly, and suppliers to deliver cost-effective, high-performance packaging solutions that meet SI, thermal and reliability requirements.

This role requires hands-on experience with 2.5D/3D packaging, substrates, interposers, bumping and wafer-level processes, plus strong project management and global collaboration skills.