Director, Advanced IC Packaging & Tech Strategy

Ledgent Technology

Sunnyvale (CA)

On-site

USD 185,000 - 225,000

Full time

11 hours ago
Be an early applicant
Application generator

Turn this role into an interview — a resume and cover letter built around what this employer wants.

Get past ATS filters

Job summary

Ledgent Technology in Sunnyvale invites a Director of Engineering for semiconductor packaging. You will drive technology platforms, promote market adoption, and align customer requirements with development roadmaps across Sales, Factory Engineering, and R&D.

The role requires 12+ years in semiconductor packaging, expertise in 2.5D/3D, chiplet architectures, and system-in-package solutions, plus strong communication skills to engage customers and industry partners. Travel to events is common.

Qualifications

  • Bachelor's, Master's, or PhD in Electrical, Materials, Mechanical, Chemical Engineering, or Physics.
  • 12+ years in semiconductor industry, with packaging experience.
  • Strong verbal and written communication; proven proposals and reports.
  • Experience with DOE, BOM, and thermo-mechanical assessments.

Responsibilities

  • Promote strategic technology platforms to global customers.
  • Provide technical leadership in engagements with customer engineering teams.
  • Translate customer roadmaps into packaging strategies and business opportunities.
  • Represent the company at industry events and forums.
  • Drive partnerships leading to new business opportunities and design wins.

Skills

Semiconductor packaging
Chiplet architectures
2.5D/3D integration
System-in-Package
Customer engagement

Education

Bachelor’s/Master’s/PhD in Electrical, Materials, Mechanical, Chemical Engineering, or Physics

Tools

FEA
HFSS
CFD
Cadence APD

Job description

Ledgent Technology in Sunnyvale invites a Director of Engineering for semiconductor packaging. You will drive technology platforms, promote market adoption, and align customer requirements with development roadmaps across Sales, Factory Engineering, and R&D.

The role requires 12+ years in semiconductor packaging, expertise in 2.5D/3D, chiplet architectures, and system-in-package solutions, plus strong communication skills to engage customers and industry partners. Travel to events is common.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Director of Engineering - Advanced Packaging
Director of Engineering - Advanced Packaging

Ledgent Technology • Sunnyvale (CA)

On-site
USD 180,000 - 200,000
Director of Engineering - Semiconductor / IC Packaging
Director of Engineering - Semiconductor / IC Packaging

Ledgent Technology • Sunnyvale (CA)

On-site
USD 185,000 - 225,000
Director of Engineering
Director of Engineering

Ledgent Technology • Sunnyvale (CA)

On-site
USD 180,000 - 200,000
Global Packaging Tech Director – Semiconductors
Global Packaging Tech Director – Semiconductors

Cie Dfw • Dallas (TX), Northern (KY)

Hybrid
USD 180,000 - 280,000
Senior IC Packaging Engineer - 2.5D/3D & TSV Expert
Senior IC Packaging Engineer - 2.5D/3D & TSV Expert

Avicena Tech • Sunnyvale (CA)

On-site
USD 140,000 - 190,000
Senior IC Packaging Architect — Hybrid
Senior IC Packaging Architect — Hybrid

Advanced Micro Devices • San Jose (CA)

Hybrid
USD 120,000 - 160,000
IC Package Engineer - 2.5D/3D Packaging & SI/PI
IC Package Engineer - 2.5D/3D Packaging & SI/PI

Gsme • San Jose (CA), Northern (KY)

Hybrid
USD 110,000 - 170,000
Director of Advanced 2.5D/3D Packaging & Partnerships
Director of Advanced 2.5D/3D Packaging & Partnerships

MediaTek Research Lab Inc. • San Jose (CA)

On-site
USD 200,000 - 323,000
Comprehensive health insurance
401(k)
Parental leave
Lead Packaging Architect: 2.5D/3D & Chiplet Systems
Lead Packaging Architect: 2.5D/3D & Chiplet Systems

MediaTek • San Jose (CA)

On-site
USD 171,000 - 272,000
Comprehensive health insurance
401(k) and parental leave
Performance bonuses
Director of Engineering (Packaging)
Director of Engineering (Packaging)

EpsilonR • Cedar Rapids (IA)

On-site
USD 166,000 - 334,000
Premium-free medical plan
401(k) with match
Employee Stock Purchase Plan (ESPP)
+3