Lead Thermo-Mechanical Packaging Engineer, 2.5D AI

DensityAI; Mountain View (CA); On-site; USD 200,000 - 275,000; Full time

Job summary

DensityAI is seeking a senior packaging mechanical engineer to own thermo-mechanical modeling and FEA for advanced multi-die packages, including 2.5D designs. You will lead the mechanical design of lids, stiffeners, underfills, TIMs, and bondlines, coordinating with OSATs and substrate suppliers to enforce robust signoffs.

You will correlate simulations with measurements and drive DOE activities to close gaps between modeling and silicon, while advancing AI-assisted tool flows for faster

Qualifications

• 8+ years of packaging mechanical experience on high-performance designs, including 2.5D/3D and multi-die packages.
• Experience with CoWoS, EMIB, InFO, fan-out or equivalent and HBMs.
• Proficiency with industry-standard FEA tools (Ansys Mechanical, Abaqus).
• Ability to converge mechanical designs with JEDEC and IPC standards.

Responsibilities

• Own thermo-mechanical modeling and FEA for multi-die packages across reflow and assembly.
• Own package mechanical design: lid, heat spreader, stiffener, underfill and TIM selection, and bondline control at the interface.
• Drive assembly process mechanics with OSATs and suppliers, and own socket and load-frame mechanics for high-force accelerator sockets.
• Correlate models to measurement (shadow moire, strain gauge, DIC) and drive DOEs to close the gap between simulation and silicon.
• Use and develop AI-assisted tool flows to accelerate mechanical modeling and signoff timelines.

Skills

Thermo-mechanical analysis

Packaging mechanical design

Cross-functional collaboration

JEDEC IPC standards knowledge

Modeling of warpage and stress

Tools

Ansys Mechanical

Abaqus

DIC measurement

Shadow Moire

Job description

DensityAI is seeking a senior packaging mechanical engineer to own thermo-mechanical modeling and FEA for advanced multi-die packages, including 2.5D designs. You will lead the mechanical design of lids, stiffeners, underfills, TIMs, and bondlines, coordinating with OSATs and substrate suppliers to enforce robust signoffs.

You will correlate simulations with measurements and drive DOE activities to close gaps between modeling and silicon, while advancing AI-assisted tool flows for faster