Advanced Package Technology Engineer

Jobtailor; California (MO); On-site; USD 120,000 - 180,000; Full time

Job summary

Jobtailor, a leader in advanced packaging, seeks a senior engineer to drive 2.5D/3D development across diverse programs. You will collaborate with design, marketing, NPI, assembly, and suppliers to deliver cost-effective, high-performance packaging solutions that meet SI, thermal and reliability requirements.

This role requires hands-on experience with 2.5D/3D packaging, substrates, interposers, bumping and wafer-level processes, plus strong project management and global collaboration skills.

Qualifications

• Master's or PhD with strong background in advanced packaging and chip interconnects.
• Experience delivering cost-effective, high-performance 2.5D/3D packaging solutions.
• Knowledge of substrates, interposers, bumping and wafer-level packaging.
• Familiarity with design rules, assembly processes and failure analysis tools.
• Ability to manage cross-functional programs and supplier engagements.

Responsibilities

• Develop cost-effective, high-performance advanced packaging solutions.
• Collaborate with silicon/package design, marketing, NPI, assembly and suppliers.
• Ensure designs meet signal integrity, thermal, structural reliability and schedules.
• Provide expertise in 2.5D / 3D technology for customers.
• Consolidate requirements towards unified solutions.
• Lead development and qualification programs with external partners.
• Engage memory suppliers to define tech and quality requirements.
• Interface with DI, package design and test teams as a cross-functional unit.
• Support new design wins, NPI and volume ramps.
• Develop alternate sourcing and qualification strategies.
• Translate concepts into structured projects and innovative solutions.
• Manage multiple programs concurrently.

Skills

2.5D / 3D development

Advanced packaging solutions

Project management

Thermal modelling

Silicon fabrication knowledge

Communication skills

Education

Master's Degree in Mechanical / Electrical / Electronics Engineering

PhD with relevant experience

Tools

APD

AutoCAD

Solidworks

Job description

• Develop cost-effective, high-performance advanced custom package solutions
• Work closely with silicon and package design, marketing, NPI, assembly and substrate suppliers, and customers
• Ensure solutions meet signal integrity, thermal, structural reliability, substrate fabrication and package assembly design-rule requirements and project schedules
• Provide expertise in 2.5D / 3D technology and engage current and future customers on technology needs and updates
• Consolidate requirements and drive toward unified solutions
• Lead identification, development and qualification programs with external assembly partners
• Manage engagement with memory suppliers to define technology and quality requirements
• Interface with DI, package design and test development teams as part of a cross-functional team
• Support new design wins, NPI and volume ramps
• Develop alternate sourcing and qualification
• Develop concepts into structured projects and generate innovative solutions to complex problems
• Handle multiple programs concurrently

Requirements

• Master's Degree in Mechanical / Electrical / Electronics Engineering with 6+ years of relevant experience, or PhD with 3+ years of relevant experience
• 4–6 years hands-on experience in 2.5D / 3D development
• Experience developing cost-effective, high-performance single- and multi-chip, large, complex, custom and fine-pitch flip-chip packaging solutions
• Experience with advanced multi-layer ceramic / organic substrates and interposers
• Experience with standard and thermally enhanced fine-pitch leaded and BGA wire-bond and wafer-level packaging solutions
• In-depth knowledge of advanced silicon fabrication, bump, interposer, substrate and assembly processes
• Knowledge of materials and supplier selection and BOM definition
• Knowledge of thermal and mechanical interactions
• Knowledge and hands-on experience in advanced, prevailing and emerging silicon, package and substrate technologies
• Experience with bumping and assembly processes, design rules, failure analysis tools and techniques, materials and equipment
• Knowledge of applicable industry standards, regulations and quality systems
• Project management, analytical, problem-solving and interpersonal skills
• Hands-on experience using thermal and mechanical modelling and substrate / PCB design CAD tools such as APD, AutoCAD and Solidworks
• Knowledge of advanced-node silicon fabrication, PCB technologies and board assembly processes
• Ability to communicate with internal and external team members and customers in various global locations
• Ability and willingness to travel from time to time

Core Competencies

Demonstrates expertise in 2.5D and 3D packaging technologies, with a strong focus on developing cost-effective, high-performance solutions that meet stringent design and quality requirements. Proficient in project management and cross-functional collaboration to drive innovative solutions in complex engineering environments.

Highest-signal resume keywords

• 2.5D / 3D Development
• Advanced Packaging Solutions
• Project Management
• Thermal and Mechanical Modelling
• Silicon Fabrication Knowledge

Hard Skills

• Mechanical Engineering
• Electrical Engineering
• Custom Packaging Solutions
• Failure Analysis Techniques
• Bump and Assembly Processes
• Design Rules
• Thermal and Mechanical Interactions
• Advanced Substrate Technologies
• PCB Design
• BOM Definition

Soft Skills

• Analytical Skills
• Problem-Solving Skills
• Interpersonal Skills
• Communication Skills

Industry Keywords

• Signal Integrity
• Thermal Reliability
• Structural Reliability
• Quality Systems
• NPI
• Cross-Functional Team Collaboration

Tools & Technologies

• APD
• AutoCAD
• Solidworks