Pioneering 2.5D/3D Package Engineer for NPI

Socket.dev; Fort Collins (CO); On-site; USD 140,000 - 200,000; Full time

Benefits offered by this job

Medical, dental and vision plans

401(K) with company matching

Employee Stock Purchase Program (ESPP)

Employee Assistance Program (EAP)

Paid holidays

Job summary

Broadcom in Colorado is seeking an Advanced Package Technology Engineer to drive 2.5D/3D packaging, thermal and signal integrity for high performance substrates. You will lead technology development, engage memory suppliers, and coordinate with DI, Pkg Design, Test Dev across a cross-functional team to meet NPI and design-win goals.

Master’s degree with 6+ years in advanced packaging or a PhD with 3+ years, plus hands-on experience in 2.5D/3D development and related CAD tools, is required.

Qualifications

• Master's degree in Mechanical/Electrical/Electronics with 6+ years of relevant experience in 2.5D/3D packaging solutions.
• PhD with 3+ years can substitute for industry experience.
• Hands-on experience in 2.5D/3D development and related substrates/assembly processes.

Responsibilities

• Provide deeper expertise in 2.5D/3D technology and engage customers on needs.
• Lead in identification, development and qualification; manage programs with external partners.
• Engage memory suppliers to define tech and quality requirements.
• Interface with cross-functional teams (DI, Pkg Design, Test Dev).
• Support new design wins, NPI and volume ramps.
• Develop alternate sourcing and qualification strategies.

Skills

2.5D/3D packaging

Project management

Thermal/Mechanical modeling

CAD tools

Team collaboration

Education

Master's degree in Mechanical/Electrical/Electronic Engineering

PhD in Engineering (optional)

Tools

APD

AutoCAD

SolidWorks

Job description

Broadcom in Colorado is seeking an Advanced Package Technology Engineer to drive 2.5D/3D packaging, thermal and signal integrity for high performance substrates. You will lead technology development, engage memory suppliers, and coordinate with DI, Pkg Design, Test Dev across a cross-functional team to meet NPI and design-win goals.

Master’s degree with 6+ years in advanced packaging or a PhD with 3+ years, plus hands-on experience in 2.5D/3D development and related CAD tools, is required.