Advanced Package Technology Engineer

Socket.dev; Fort Collins (CO); On-site; USD 140,000 - 200,000; Full time

Benefits offered by this job

Medical, dental and vision plans

401(K) with company matching

Employee Stock Purchase Program (ESPP)

Employee Assistance Program (EAP)

Paid holidays

Job summary

Broadcom in Colorado is seeking an Advanced Package Technology Engineer to drive 2.5D/3D packaging, thermal and signal integrity for high performance substrates. You will lead technology development, engage memory suppliers, and coordinate with DI, Pkg Design, Test Dev across a cross-functional team to meet NPI and design-win goals.

Master’s degree with 6+ years in advanced packaging or a PhD with 3+ years, plus hands-on experience in 2.5D/3D development and related CAD tools, is required.

Qualifications

• Master's degree in Mechanical/Electrical/Electronics with 6+ years of relevant experience in 2.5D/3D packaging solutions.
• PhD with 3+ years can substitute for industry experience.
• Hands-on experience in 2.5D/3D development and related substrates/assembly processes.

Responsibilities

• Provide deeper expertise in 2.5D/3D technology and engage customers on needs.
• Lead in identification, development and qualification; manage programs with external partners.
• Engage memory suppliers to define tech and quality requirements.
• Interface with cross-functional teams (DI, Pkg Design, Test Dev).
• Support new design wins, NPI and volume ramps.
• Develop alternate sourcing and qualification strategies.

Skills

2.5D/3D packaging

Project management

Thermal/Mechanical modeling

CAD tools

Team collaboration

Education

Master's degree in Mechanical/Electrical/Electronic Engineering

PhD in Engineering (optional)

Tools

APD

AutoCAD

SolidWorks

Job description

Job Description:

As part of WW ASIC product development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost effective high performance, advanced custom package solutions achieving signal integrity, thermal, structural reliability, substrate fab/package assembly design rules & project schedule requirements. •2.5D & 3D is cutting edge package technology with BRCM’s needs pushing the technology limits.

Job Scope (Advanced Package Technology Engineer)

• Provide deeper expertise in 2.5D / 3D technology; current and future customer engagement on technology needs & updates, consolidation of requirements and drive towards unified solution.
• Lead in identification, development & qualification; program management with external assembly partners
• Lead in memory supplier(s) engagement to define technology and quality requirements.
• Interface with other technical teams (DI, Pkg Design, Test Dev) etc. as part of Cross Functional Team.
• Support new design wins, NPI and volume ramps.
• Develop alternate sourcing & qualification.

Basic: Master's Degree in Mechanical / Electrical / Electronics Engineering with 6+ years of relevant experience in developing cost effective, high performance (speed, density, pin count, thermal & reliable), single & multi-chip, large, complex, custom & fine pitch flip chip packaging solution with advanced multi-layer ceramic / organic substrates & Interposers; Standard & thermally enhanced fine pitch leaded & BGA wire bond & wafer level packaging solution; or PhD with 3+ years of relevant experience

Specific: 4~6 years Hands On experience in 2.5D / 3D Development; In-depth Know-how of Advanced Silicon fab, Bump, Interposer, substrate & assembly processes, materials & supplier selection, BOM definition, thermal and mechanical interactions.

Others:

• Sound knowledge of & hands on experience in advanced, prevailing and emerging silicon, package & substrate technologies, bumping and assembly processes, design rules, failure analysis tools and techniques, materials and equipment, applicable industry standards, regulations & quality systems.
• Good team player with project management, analytical, problem-solving and interpersonal skills. Must be self-driven, flexible and agile, result oriented individual. Ability to develop concepts into structured projects, generate new and innovative solutions to complex problems and handle multiple programs concurrently.
• Hands-on experience of use of modelling (Thermal & Mechanical) & Sub / PCB Design CAD tools (APD, AutoCAD, Solidworks etc) for design optimization.
• Sound knowledge of advanced node silicon fabrication, PCB technologies and board assembly processes, applicable industry standards, quality systems and regulations.
• Communicate extensively with internal and external team members, customers in various global locations and may require travel from time to time.

Compensation and Benefits

The annual base salary range for this position is To

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

• Medical, dental and vision plans
• 401(K) participation including company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• company paid holidays
• paid sick leave and vacation time
• The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.