Hybrid Mechanical Engineer I – Hardware & Thermal Design

Hewlett Packard Enterprise Company in; Spring (TX); Hybrid; USD 56,000 - 126,000; Full time

Job summary

Hewlett Packard Enterprise seeks a Mechanical/Hardware Engineer I Graduate to design mechanical hardware, electronics enclosures, and production tooling. The role emphasizes analysis, testing, and collaboration with internal and external partners to deliver reliable, cost-effective solutions.

Requirements include a Bachelor's or Master's in Mechanical Engineering with 0–2 years of experience, and familiarity with 3D CAD tools like ProEngineer. The position is hybrid with office days required.

Qualifications

• Experience with engineering analysis and mechanical design.
• Understanding of thermodynamics and heat transfer applied to hardware.
• Strong written and verbal communication in English.

Responsibilities

• Designs portions of mechanical hardware and electronics enclosures per specifications.
• Implements test plans validating tolerances, form/fit/function, shock and acoustics.
• Collaborates with internal and external partners on design development.
• Participates in project teams to deliver reliable, cost-effective solutions.

Skills

Analytical skills

English communication

Understanding of sheet metal & plastic

Education

Bachelor's or Master's in Mechanical Engineering

Tools

ProEngineer

Job description

Hewlett Packard Enterprise seeks a Mechanical/Hardware Engineer I Graduate to design mechanical hardware, electronics enclosures, and production tooling. The role emphasizes analysis, testing, and collaboration with internal and external partners to deliver reliable, cost-effective solutions.

Requirements include a Bachelor's or Master's in Mechanical Engineering with 0–2 years of experience, and familiarity with 3D CAD tools like ProEngineer. The position is hybrid with office days required.