Hybrid Mechanical Engineer – Thermal & Enclosure Design

Hewlett Packard Enterprise; Fort Collins (CO); Hybrid; USD 67,000 - 126,000; Full time

Job summary

Hewlett Packard Enterprise in Fort Collins, CO is seeking a Mechanical Engineer to design and analyze mechanical and thermal hardware, enclosures and production tooling. The role involves CREO-based development, tolerance validation, and collaboration with internal and external partners to deliver reliable solutions.

You will apply CFD tools and engineering judgment to optimize cooling, power, and acoustics while communicating clearly with teammates and stakeholders.

Qualifications

• Bachelor's or Master's degree in Mechanical Engineering or Engineering Technology.
• Typically 2-4 years of experience.
• Proficiency with CREO or similar 3D CAD software.
• Experience designing sheet metal and plastic parts and production tooling.

Responsibilities

• Designs portions of mechanical and thermal hardware and production tooling.
• Develops tester plans, validates tolerances, and assesses form/fit/function.
• Collaborates with internal and external development partners on design challenges.
• Contributes to reliable, cost-effective, high-quality engineering solutions.

Skills

Analytical thinking

Problem solving

Verbal communication

Written communication

English proficiency

Education

Bachelor's or Master's degree in Mechanical Engineering or Engineering Technology

Tools

CREO 3D CAD

CFD simulations

Job description

Hewlett Packard Enterprise in Fort Collins, CO is seeking a Mechanical Engineer to design and analyze mechanical and thermal hardware, enclosures and production tooling. The role involves CREO-based development, tolerance validation, and collaboration with internal and external partners to deliver reliable solutions.

You will apply CFD tools and engineering judgment to optimize cooling, power, and acoustics while communicating clearly with teammates and stakeholders.