Hybrid Mechanical Engineer I — Hardware & Enclosures

Hewlett Packard Enterprise Development LP; Spring (TX); Hybrid; USD 56,000 - 126,000; Full time

Benefits offered by this job

Hybrid work model

Job summary

Hewlett Packard Enterprise Development LP in Texas is seeking a Mechanical/Hardware Engineer I Graduate for a hybrid role with 2 days per week in an HPE office. You will design mechanical and thermal components, analyze designs, and support tooling and enclosures under guidance.

The position targets 0–2 years of experience, requires a Bachelor's or Master's in Mechanical Engineering, and familiarity with 3D CAD tools such as Pro/Engineer.

Qualifications

• Bachelor's or Master's degree in Mechanical Engineering.
• Typically 0–2 years of experience.
• Good written and verbal communication in English.

Responsibilities

• Design mechanical and thermal hardware, electronics enclosures, and tooling.
• Execute test plans to validate tolerances, form/fit/function, and safety.
• Collaborate with internal and external partners on mechanical design development.

Skills

3D CAD

Analytical thinking

English communication

Education

Bachelor's or Master's in Mechanical Engineering

Tools

Pro/Engineer (ProE)

Job description

Hewlett Packard Enterprise Development LP in Texas is seeking a Mechanical/Hardware Engineer I Graduate for a hybrid role with 2 days per week in an HPE office. You will design mechanical and thermal components, analyze designs, and support tooling and enclosures under guidance.

The position targets 0–2 years of experience, requires a Bachelor's or Master's in Mechanical Engineering, and familiarity with 3D CAD tools such as Pro/Engineer.