HBM Thermal Integration Engineer — Optimize Thermal for AI

1000 Micron Technology, Inc.; Richardson (TX); Sur place; USD 140 000 - 190 000; Plein temps

Avantages offerts par ce poste

Medical/Dental/Vision

Paid time off

Benefits information available

Résumé du poste

Micron Technology, Inc. is seeking an experienced MTS - HBM Thermal Integration Engineer to optimize thermal performance for next-generation HBM products.

The role spans thermal simulation, silicon characterization, process technology, packaging, and product integration, collaborating across fabrication, assembly, and reliability teams. The candidate will develop DOE plans, analyze large datasets, and drive engineers to reduce thermal resistance while improving product performance in a

Qualifications

• PhD (5+ years) or MSc (10+ years) in Mechanical Engineering, Materials Science, Physics, Semiconductor/Electrical Engineering, or related field.
• Hands-on semiconductor product development experience in memory, logic, or advanced packaging.
• Experience with thermal simulation and DOE-based investigations.
• Ability to analyze large datasets and inline metrology data to identify drivers and variation sources.

Responsabilités

• Drive thermal performance optimization across HBM products through design, process, packaging, assembly, and test improvements.
• Develop and implement thermal learning plans, characterization strategies, and DOE-based investigations.
• Analyze silicon characterization, inline metrology, manufacturing, and test data to identify key drivers of thermal behavior and variation.
• Partner with thermal simulation teams to improve understanding and correlation between models and measured silicon performance.
• Collaborate with wafer fabrication, package development, assembly, product engineering, and reliability teams to resolve thermal challenges.
• Identify and implement opportunities to reduce thermal resistance and enhance product performance.
• Drive cross-functional technical investigations and influence engineering decisions through data-driven analysis.

Connaissances

Thermal engineering

Data-driven analysis

DOE methodology

Multiphysics modeling

Python data analysis

Cross-functional collaboration

Formation

PhD with 5+ years or MS with 10+ years in a relevant engineering field

Outils

Ansys

Abaqus

Icepak

FloTHERM

Star-CCM+

Python

MATLAB

SQL

JMP

Description du poste

Micron Technology, Inc. is seeking an experienced MTS - HBM Thermal Integration Engineer to optimize thermal performance for next-generation HBM products.

The role spans thermal simulation, silicon characterization, process technology, packaging, and product integration, collaborating across fabrication, assembly, and reliability teams. The candidate will develop DOE plans, analyze large datasets, and drive engineers to reduce thermal resistance while improving product performance in a