HBM Customer Integration Tech Lead - AI & Systems

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 140,000 - 190,000; Full time

Benefits offered by this job

Medical, dental, vision plans

Paid time off

Retirement benefits

Job summary

Micron Technology, Inc. in Boise, Idaho is seeking a Technical Leader to serve as the primary technical interface between customers and internal engineering teams for advanced HBM solutions. The role focuses on translating customer requirements into internal design and manufacturing plans with emphasis on AI-enabled processes.

You will mentor teams on HBM architecture, signal integrity, thermal solutions, and packaging while driving system validation, debugging, and customer enablement workflows.

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering or related field.
• 10+ years in semiconductor product engineering, system integration, or customer-facing technical roles.
• Hands-on experience with HBM architecture, packaging, and manufacturing processes.
• Ability to interpret customer system-level requirements and map them to internal capabilities.
• Strong communication and collaboration across technical and non-technical teams.

Responsibilities

• Understand customer system architecture and integration challenges.
• Translate customer needs into actionable requirements for internal teams.
• Mentor on HBM architecture, signal integrity, thermal solutions, and packaging.
• Develop and deploy AI systems to automate processes and address challenges.
• Collaborate across front-end/back-end process engineering, product development, and manufacturing.
• Lead design reviews, failure analyses, and yield improvement initiatives.

Skills

Customer engagement

System integration

Technical leadership

AI systems deployment

Communication

Root cause analysis

Education

Electrical/Electronic Eng. degree

Tools

HBM architecture

Packaging tech

Debugging tools

Job description

Micron Technology, Inc. in Boise, Idaho is seeking a Technical Leader to serve as the primary technical interface between customers and internal engineering teams for advanced HBM solutions. The role focuses on translating customer requirements into internal design and manufacturing plans with emphasis on AI-enabled processes.

You will mentor teams on HBM architecture, signal integrity, thermal solutions, and packaging while driving system validation, debugging, and customer enablement workflows.