MTS - HBM Thermal Integration Engineer

1000 Micron Technology, Inc.; Richardson (TX); On-site; USD 140,000 - 190,000; Full time

Benefits offered by this job

Medical/Dental/Vision

Paid time off

Benefits information available

Job summary

Micron Technology, Inc. is seeking an experienced MTS - HBM Thermal Integration Engineer to optimize thermal performance for next-generation HBM products.

The role spans thermal simulation, silicon characterization, process technology, packaging, and product integration, collaborating across fabrication, assembly, and reliability teams. The candidate will develop DOE plans, analyze large datasets, and drive engineers to reduce thermal resistance while improving product performance in a

Qualifications

• PhD (5+ years) or MSc (10+ years) in Mechanical Engineering, Materials Science, Physics, Semiconductor/Electrical Engineering, or related field.
• Hands-on semiconductor product development experience in memory, logic, or advanced packaging.
• Experience with thermal simulation and DOE-based investigations.
• Ability to analyze large datasets and inline metrology data to identify drivers and variation sources.

Responsibilities

• Drive thermal performance optimization across HBM products through design, process, packaging, assembly, and test improvements.
• Develop and implement thermal learning plans, characterization strategies, and DOE-based investigations.
• Analyze silicon characterization, inline metrology, manufacturing, and test data to identify key drivers of thermal behavior and variation.
• Partner with thermal simulation teams to improve understanding and correlation between models and measured silicon performance.
• Collaborate with wafer fabrication, package development, assembly, product engineering, and reliability teams to resolve thermal challenges.
• Identify and implement opportunities to reduce thermal resistance and enhance product performance.
• Drive cross-functional technical investigations and influence engineering decisions through data-driven analysis.

Skills

Thermal engineering

Data-driven analysis

DOE methodology

Multiphysics modeling

Python data analysis

Cross-functional collaboration

Education

PhD with 5+ years or MS with 10+ years in a relevant engineering field

Tools

Ansys

Abaqus

Icepak

FloTHERM

Star-CCM+

Python

MATLAB

SQL

JMP

Job description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG) and develops industry-leading High Bandwidth Memory (HBM) solutions for next-generation AI and high-performance computing systems. Micron is seeking an experienced MTS - HBM Thermal Integration Engineer to drive thermal performance optimization for next-generation High Bandwidth Memory products. This role sits at the intersection of thermal simulation, silicon characterization, process technology, package development, manufacturing, test engineering, and product integration.

Key Responsibilities

• Drive thermal performance optimization across HBM products through design, process, packaging, assembly, and test improvements.
• Develop and implement thermal learning plans, characterization strategies, and design-of-experiments (DOE) to accelerate technology understanding.
• Analyze silicon characterization, inline metrology, manufacturing, and test data to identify key drivers of thermal behavior and variation.
• Partner with thermal simulation teams to improve understanding and correlation between predictive models and measured silicon performance.
• Work closely with wafer fabrication, package development, assembly, product engineering, and reliability teams to resolve thermal challenges and enable product improvements.
• Identify and implement opportunities to reduce thermal resistance, improve thermal consistency, and enhance product performance.
• Drive cross-functional technical investigations and influence engineering decisions through data-driven analysis and structured problem solving.

Minimum Qualifications

• PhD with 5+ years of industry experience, or Master’s degree with 10+ years of industry experience, in Mechanical Engineering, Materials Science, Physics, Semiconductor Engineering, Electrical Engineering, or a related technical field
• Hands-on experience in semiconductor product development within memory, logic, or advanced packaging technologies, with a background in one or more of the following areas: Process Integration, Package Integration, Product Engineering, or Yield Engineering
• Working knowledge of thermal simulation methodologies and multiphysics modeling approaches, with the ability to interpret simulation results and apply insights to silicon, package, and technology optimization
• Experience designing, executing, and analyzing structured experiments and DOE-based investigations
• Demonstrated ability to analyze large datasets, inline metrology data, characterization results manufacturing data, and test results to identify performance drivers and sources of variation.
• Leverages AI-enabled tools and workflows to analyze data, automate routine tasks, improve decision-making, and enhance the efficiency and quality of assigned responsibilities

Preferred Qualifications

• Understanding of HBM, advanced semiconductor packaging, 2.5D/3D integration, TSV technologies, hybrid bonding, interposers, and heterogeneous integration
• Experience with thermal characterization and silicon validation techniques.
• Experience analyzing inline metrology, manufacturing, assembly, and test datasets using statistical methods
• Knowledge of variation analysis, process optimization, and root-cause investigation methodologies
• Familiarity with thermal simulation tools such as Ansys, Abaqus, Icepak, FloTHERM, Star-CCM+, or equivalent
• Experience with Python, JMP, MATLAB, SQL, or similar data analysis environments
• Experience leading cross-functional technology development initiatives in the semiconductor industry

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth.

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.

Benefits

• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.
• For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

To learn more about Micron, please visit micron.com/careers.