HBM Thermal Integration Engineer: Optimize Heat & Performance

Micron Technology, Inc.; Richardson (TX); On-site; USD 120,000 - 190,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time-off

Paid holidays and family leave

Job summary

Micron Technology, Inc. is seeking a MTS - HBM Thermal Integration Engineer in Richardson, TX to drive thermal performance optimization for next-generation HBM products.

You will integrate thermal simulation, silicon characterization, and packaging to resolve thermal challenges and enhance product reliability. The role requires advanced degrees with significant industry experience in semiconductor packaging, strong DOE execution skills, and fluency in data analysis using Python/AI-enabled tools.

Qualifications

• PhD with 5+ years in industry or Master with 10+ years in relevant fields.
• Hands-on semiconductor product development experience in memory/logic/advanced packaging.
• Experience with thermal simulation methodologies and multiphysics modeling.
• Ability to design, execute, and analyze DOE-based investigations.
• Ability to analyze large datasets from inline metrology, manufacturing, and test data.
• Familiarity with AI-enabled data analysis workflows.

Responsibilities

• Drive thermal performance optimization across HBM products.
• Develop and implement thermal learning plans and DOE-based studies.
• Analyze silicon characterization, inline metrology, and test data to identify drivers of thermal behavior.
• Collaborate with thermal simulation teams to connect models to silicon performance.
• Work with wafer fabrication, packaging, assembly, product engineering, and reliability teams to resolve thermal issues.

Skills

Thermal optimization

DOE experiments

Data analysis

Thermal simulation

Python

AI tools

Cross-functional

Education

PhD in Mechanical Engineering / related

Master's degree in Mechanical Engineering / related

Tools

ANSYS

Abaqus

Icepak

FloTHERM

Star-CCM+

Python

SQL

MATLAB

Job description

Micron Technology, Inc. is seeking a MTS - HBM Thermal Integration Engineer in Richardson, TX to drive thermal performance optimization for next-generation HBM products.

You will integrate thermal simulation, silicon characterization, and packaging to resolve thermal challenges and enhance product reliability. The role requires advanced degrees with significant industry experience in semiconductor packaging, strong DOE execution skills, and fluency in data analysis using Python/AI-enabled tools.