Thermal Simulation Engineer for HBM & 3D Packaging

Micron Technology, Inc.; Richardson (TX); On-site; USD 130,000 - 190,000; Full time

Benefits offered by this job

Medical benefits

Dental benefits

Vision plans

Job summary

Micron Technology, Inc. is seeking an experienced MTS - Thermal Simulation Engineer to lead high-fidelity thermal and thermo-mechanical modeling for HBM products.

You will drive simulation strategy, mentor engineers, and coordinate across design, packaging, and test teams. The role requires strong background in heat transfer, FEM, and multiphysics tools, with a focus on silicon correlation and packaging technologies.

Qualifications

• PhD or Master’s + extensive industry experience in thermal simulation or multiphysics modeling.
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Responsibilities

• Lead the development of high-fidelity thermal and thermo-mechanical models for HBM packages, including die, interconnects, bonding interfaces, and system-level integration.
• Define and implement multiphysics simulation strategies encompassing thermal, structural, and coupled analyses to evaluate performance, identify risks, and guide architecture and design decisions.
• Provide deep technical analysis of thermal transport, heat flux distribution, and thermo-mechanical behavior across complex stacked memory architectures.
• Lead simulation-to-silicon correlation with characterization and test teams, establish model validation criteria, and drive closure of gaps between prediction and measured behavior.
• Assess material properties, layout effects, package architecture, and manufacturing variation to identify key drivers of thermal resistance and hotspot behavior
• Influence design, packaging, process, and test teams by translating simulation results into thermally-aware product requirements and design direction
• Advance modeling methodologies, automation, and scalable simulation frameworks for HBM and advanced packaging technologies, while mentoring engineers and establishing guidelines.
• Lead the evaluation, adoption, and responsible use of AI-enabled solutions within engineering workflows, translating emerging AI capabilities into practical business value through improved productivity, innovation, quality, and speed of execution

Skills

Thermal simulation

Multiphysics modeling

FEM

Scripting

Education

PhD in Mechanical Engineering/Materials Science/Physics

Master's degree in Mechanical Engineering or related field

Tools

Ansys

Abaqus

Fluent

Star-CCM+

FloTHERM

Job description

Micron Technology, Inc. is seeking an experienced MTS - Thermal Simulation Engineer to lead high-fidelity thermal and thermo-mechanical modeling for HBM products.

You will drive simulation strategy, mentor engineers, and coordinate across design, packaging, and test teams. The role requires strong background in heat transfer, FEM, and multiphysics tools, with a focus on silicon correlation and packaging technologies.