HBM Thermal Integration Engineer — Optimize Performance

Micron Technology, Inc.; Richardson (TX); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical plans

Dental plans

Vision plans

Paid time off

Paid holidays

Relocation TBD

Job summary

Micron Technology, Inc. seeks an experienced MTS - HBM Thermal Integration Engineer to optimize thermal performance for next-generation High Bandwidth Memory products.

The role intersects thermal simulation, silicon characterization, process technology, packaging, manufacturing, and product engineering. You will develop DOE-based strategies, analyze extensive data, and collaborate across wafer fabrication, package development, and reliability teams to drive design improvements and reduce thermal

Qualifications

• PhD or MS in a relevant technical field with 5+ years of industry experience or equivalent.
• Hands-on semiconductor product development experience in memory, logic, or advanced packaging.
• Proficiency in thermal simulation methods and multiphysics modeling.
• Experience designing, executing, and analyzing DOE-based investigations.
• Ability to analyze large datasets and metrology, manufacturing, and test data to identify drivers.

Responsibilities

• Drive thermal performance optimization across HBM products through design, process, packaging, assembly, and test improvements.
• Develop and implement thermal learning plans, characterization strategies, and DOE-based investigations.
• Analyze silicon characterization, inline metrology, manufacturing, and test data to identify drivers of thermal behavior and variation.
• Collaborate with thermal simulation teams to improve correlation between models and measured performance.
• Work with wafer fabrication, package development, and reliability teams to resolve thermal challenges and enable product improvements.
• Identify opportunities to reduce thermal resistance and improve thermal consistency to enhance product performance.
• Lead cross-functional technology development initiatives using data-driven analysis.

Skills

Thermal optimization

Design of experiments (DOE)

Data analysis

Thermal simulation tools

Education

PhD or MS in Mechanical Engineering, Materials Science, Physics, or related field

Experience in semiconductor product development

Tools

Ansys

Abaqus

Icepak

FloTHERM

Python

MATLAB

SQL

Job description

Micron Technology, Inc. seeks an experienced MTS - HBM Thermal Integration Engineer to optimize thermal performance for next-generation High Bandwidth Memory products.

The role intersects thermal simulation, silicon characterization, process technology, packaging, manufacturing, and product engineering. You will develop DOE-based strategies, analyze extensive data, and collaborate across wafer fabrication, package development, and reliability teams to drive design improvements and reduce thermal