MTS - HBM Thermal Integration Engineer

Micron Technology, Inc.; Richardson (TX); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical plans

Dental plans

Vision plans

Paid time off

Paid holidays

Relocation TBD

Job summary

Micron Technology, Inc. seeks an experienced MTS - HBM Thermal Integration Engineer to optimize thermal performance for next-generation High Bandwidth Memory products.

The role intersects thermal simulation, silicon characterization, process technology, packaging, manufacturing, and product engineering. You will develop DOE-based strategies, analyze extensive data, and collaborate across wafer fabrication, package development, and reliability teams to drive design improvements and reduce thermal

Qualifications

• PhD or MS in a relevant technical field with 5+ years of industry experience or equivalent.
• Hands-on semiconductor product development experience in memory, logic, or advanced packaging.
• Proficiency in thermal simulation methods and multiphysics modeling.
• Experience designing, executing, and analyzing DOE-based investigations.
• Ability to analyze large datasets and metrology, manufacturing, and test data to identify drivers.

Responsibilities

• Drive thermal performance optimization across HBM products through design, process, packaging, assembly, and test improvements.
• Develop and implement thermal learning plans, characterization strategies, and DOE-based investigations.
• Analyze silicon characterization, inline metrology, manufacturing, and test data to identify drivers of thermal behavior and variation.
• Collaborate with thermal simulation teams to improve correlation between models and measured performance.
• Work with wafer fabrication, package development, and reliability teams to resolve thermal challenges and enable product improvements.
• Identify opportunities to reduce thermal resistance and improve thermal consistency to enhance product performance.
• Lead cross-functional technology development initiatives using data-driven analysis.

Skills

Thermal optimization

Design of experiments (DOE)

Data analysis

Thermal simulation tools

Education

PhD or MS in Mechanical Engineering, Materials Science, Physics, or related field

Experience in semiconductor product development

Tools

Ansys

Abaqus

Icepak

FloTHERM

Python

MATLAB

SQL

Job description

Req ID: JR114768 MTS - HBM Thermal Integration Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG) and develops industry-leading High Bandwidth Memory (HBM) solutions for next-generation AI and high-performance computing systems.

Micron is seeking an experienced MTS - HBM Thermal Integration Engineer to drive thermal performance optimization for next-generation High Bandwidth Memory products. This role sits at the intersection of thermal simulation, silicon characterization, process technology, package development, manufacturing, test engineering, and product integration.

Key Responsibilities

• Drive thermal performance optimization across HBM products through design, process, packaging, assembly, and test improvements
• Develop and implement thermal learning plans, characterization strategies, and design-of-experiments (DOE) to accelerate technology understanding
• Analyze silicon characterization, inline metrology, manufacturing, and test data to identify key drivers of thermal behavior and variation
• Partner with thermal simulation teams to improve understanding and correlation between predictive models and measured silicon performance.
• Work closely with wafer fabrication, package development, assembly, product engineering, and reliability teams to resolve thermal challenges and enable product improvements.
• Identify and implement opportunities to reduce thermal resistance, improve thermal consistency, and enhance product performance.
• Drive cross-functional technical investigations and influence engineering decisions through data-driven analysis and structured problem solving.

Minimum Qualifications

• PhD with 5+ years of industry experience, or Master’s degree with 10+ years of industry experience, in Mechanical Engineering, Materials Science, Physics, Semiconductor Engineering, Electrical Engineering, or a related technical field
• Hands-on experience in semiconductor product development within memory, logic, or advanced packaging technologies, with a background in one or more of the following areas: Process Integration, Package Integration, Product Engineering, or Yield Engineering
• Working knowledge of thermal simulation methodologies and multiphysics modeling approaches, with the ability to interpret simulation results and apply insights to silicon, package, and technology optimization
• Experience designing, executing, and analyzing structured experiments and DOE-based investigations
• Demonstrated ability to analyze large datasets, inline metrology data, characterization results manufacturing data, and test results to identify performance drivers and sources of variation.
• Leverages AI-enabled tools and workflows to analyze data, automate routine tasks, improve decision-making, and enhance the efficiency and quality of assigned responsibilities

Preferred Qualifications

• Understanding of HBM, advanced semiconductor packaging, 2.5D/3D integration, TSV technologies, hybrid bonding, interposers, and heterogeneous integration
• Experience with thermal characterization and silicon validation techniques.
• Experience analyzing inline metrology, manufacturing, assembly, and test datasets using statistical methods
• Knowledge of variation analysis, process optimization, and root-cause investigation methodologies
• Familiarity with thermal simulation tools such as Ansys, Abaqus, Icepak, FloTHERM, Star-CCM+, or equivalent
• Experience with Python, JMP, MATLAB, SQL, or similar data analysis environments
• Experience leading cross-functional technology development initiatives in the semiconductor industry

Job Profile(s):

Systems Design Engineering MTS

Relocation Level: TBD

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth.

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.