Lead Mechanical & Thermal Engineer for AI HPC Cooling

Micron Technology, Inc.; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical benefits

Paid time off

Job summary

Micron Technology, Inc. is seeking a highly experienced Mechanical & Thermal Engineer to drive the mechanical and thermal architecture of cutting-edge memory hardware. The role involves leading design, validation, and testing of cooling solutions across multi-disciplinary teams.

You will influence product strategy, mentor engineers, and champion AI-enabled engineering workflows for simulation and optimization in a fast-paced semiconductor environment.

Qualifications

• Degree in Mechanical Engineering with 7+ years in electronics, storage, or semiconductor industries.
• Proven track record delivering mechanical/thermal solutions from concept to high-volume manufacturing.
• Hands-on with thermal management technologies and reliability testing.

Responsibilities

• Design, develop, test, validate, and release mechanical and thermal solutions for advanced electronic systems.
• Develop cooling solutions including heat spreaders, heatsinks, vapor chambers, heat pipes, and liquid cooling.
• Lead thermal CFD and mechanical FEA analyses to optimize performance and reliability.

Skills

Thermal engineering

Mechanical design

Thermal CFD

Problem solving

Cross-functional collaboration

Education

Bachelor's or Master's in Mechanical Engineering

Tools

SolidWorks

ANSYS Icepak

Fluent

FEM

Job description

Micron Technology, Inc. is seeking a highly experienced Mechanical & Thermal Engineer to drive the mechanical and thermal architecture of cutting-edge memory hardware. The role involves leading design, validation, and testing of cooling solutions across multi-disciplinary teams.

You will influence product strategy, mentor engineers, and champion AI-enabled engineering workflows for simulation and optimization in a fast-paced semiconductor environment.