HBM Design Engineering Lead for AI/ML Systems

Micron Technology, Inc.; Texas; Presencial; USD 180.000 - 260.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Medical, dental, vision plans

Paid time off

Benefits guide

Descripción de la vacante

Micron Technology, Inc. seeks a senior technical contributor and project leader to shape next‑generation HBM solutions for AI and accelerated computing.

You will guide architecture through silicon bring‑up, partnering with design, process, packaging, and product teams to deliver reliable silicon with broad business impact. You will mentor engineers, drive design execution discipline, and influence future memory architectures while addressing power, performance, and reliability trade‑offs for

Formación

• 15+ years in DRAM, HBM, or memory IC design roles.
• Experience delivering complex designs from architecture to silicon bring‑up.
• Strong DRAM operation knowledge and JEDEC standards.
• CMOS circuit design and device physics expertise.

Responsabilidades

• Own HBM design blocks from architecture to tape‑out and post‑silicon debug.
• Balance performance, power, reliability, yield, and manufacturability trade‑offs.
• Lead root‑cause analysis across pre/post‑silicon issues.
• Coordinate cross‑functional teams across architecture, layout, verification, packaging.

Conocimientos

HBM design experience

DRAM memory expertise

JEDEC standards

Verilog

Digital design

Analog modeling

Post-silicon debug

Project leadership

2.5D/3D packaging exposure

Herramientas

FastSpice

HSPICE

Descripción del empleo

Micron Technology, Inc. seeks a senior technical contributor and project leader to shape next‑generation HBM solutions for AI and accelerated computing.

You will guide architecture through silicon bring‑up, partnering with design, process, packaging, and product teams to deliver reliable silicon with broad business impact. You will mentor engineers, drive design execution discipline, and influence future memory architectures while addressing power, performance, and reliability trade‑offs for