HBM Characterization Intern

1000 Micron Technology, Inc.; Richardson (TX); On-site; USD 110,000 - 150,000; Full time

Benefits offered by this job

Medical plan

Dental plan

Vision plan

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. seeks an experienced test engineer to advance HBM characterization through bench-level testing and data analysis. You will design custom test setups, run thermal and electrical stress tests, and develop Python/Verilog/C/C++ programs to accelerate root-cause investigations.

The role emphasizes cross-discipline collaboration and applying AI tools to improve workflows, data interpretation, and test development efficiency at the Richardson site.

Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, Materials Science, Physics or related field.
• 3+ years in semiconductor characterization, failure analysis, test engineering, or related area.
• Hands-on with oscilloscopes, SMUs, power supplies, thermal systems, probe stations or automated test hardware.
• Programming in Python and at least one of C/C++ or Verilog; strong data analysis skills.

Responsibilities

• Design, build and debug custom bench-level test setups and measurement flows for HBM devices.
• Characterize devices under thermal, mechanical and electrical stress to improve performance and yield.
• Develop Python-, Verilog-, and C/C++-based test programs and workloads to accelerate investigations.
• Analyze datasets and MBIST signatures to identify root causes and drive corrective actions.
• Leverage AI/Generative AI tools to improve engineering workflows and testing efficiency.

Skills

Python

C/C++

Verilog

Data analysis

Statistical methods

Education

Bachelor's degree in Electrical Engineering, Computer Engineering, Materials Science, Physics

Tools

Oscilloscopes

SMUs

Power supplies

Thermal systems

Probe stations

Job description

Micron Technology, Inc. seeks an experienced test engineer to advance HBM characterization through bench-level testing and data analysis. You will design custom test setups, run thermal and electrical stress tests, and develop Python/Verilog/C/C++ programs to accelerate root-cause investigations.

The role emphasizes cross-discipline collaboration and applying AI tools to improve workflows, data interpretation, and test development efficiency at the Richardson site.