HBM Platform Architecture Intern — Next-Gen Memory

Micron; Folsom (CA); Hybrid; USD 59,000 - 80,000; Full time

Job summary

Micron Technology in California is seeking an HBM Platform Architecture Intern to contribute to the development of future HBM platforms by evaluating electrical, thermal, and power delivery architectures and by building modeling tools.

You will work with experienced architects to analyze design trade-offs, develop automation tooling in Python, and collaborate with architecture, design, packaging, and technology teams to improve performance, power efficiency, reliability, and scalability for

Qualifications

• 0-2 years of relevant experience in electrical engineering, VLSI design, signal integrity, power integrity, thermal analysis, semiconductor design, or related fields.
• Currently pursuing a Bachelor's, Master's, or PhD in Electrical Engineering, Electronics Engineering, Computer Engineering, or Computer Science.
• Coursework or project experience in analog design, I/O design, signaling, DRAM technologies, high-speed interfaces, packaging, or 2.5D/3D integration technologies.
• Understanding of electrical systems, signal integrity, power delivery, circuit analysis, or semiconductor design fundamentals.
• Ability to read and interpret technical specifications, datasheets, interface standards, and hardware documentation.
• Strong analytical, problem-solving, and technical communication skills.
• Experience using AI-enabled tools and LLMs as part of engineering workflows, with ability to validate AI outputs.

Responsibilities

• Perform signaling and timing analysis for on-die and off-die interfaces across multiple system/topologies.
• Develop and evaluate thermal models to analyze heat transfer and performance in memory systems.
• Analyze power delivery networks, including IR-drop, EM, power integrity, and PDN optimization for HBM architectures.
• Develop modeling, simulation, and automation tools to support PDN, thermal, and architecture evaluations.
• Collaborate with architecture, design, packaging, and technology teams to evaluate system-level trade-offs and future HBM development.

Skills

Electrical engineering

VLSI design

Signal integrity

Power integrity

Thermal analysis

Semiconductor design

Analytical skills

Python

AI tools

Education

Bachelor's/Master's/PhD in Electrical Engineering or related

Tools

Cadence EDA

MATLAB

Thermal analysis tools

Signal integrity tools

Python

Job description

Micron Technology in California is seeking an HBM Platform Architecture Intern to contribute to the development of future HBM platforms by evaluating electrical, thermal, and power delivery architectures and by building modeling tools.

You will work with experienced architects to analyze design trade-offs, develop automation tooling in Python, and collaborate with architecture, design, packaging, and technology teams to improve performance, power efficiency, reliability, and scalability for