Next-Gen HBM Platform Architect Intern

Micron Technology, Inc.

Folsom (CA)

On-site

USD 94,000 - 114,000

Full time

13 days ago

Get a reply from this employer

Your resume and cover letter, tailored to exactly what they’re hiring for.

Get past ATS filters

Job summary

Micron Technology, Inc. is seeking an HBM Platform Architecture Intern in California to contribute to development of future HBM platforms, evaluating electrical, thermal, and power delivery architectures.

You will work with experienced architects to analyze design trade-offs, develop modeling tools, and push memory system performance, power efficiency, reliability, and scalability. Minimum qualifications include 0-2 years in EE/CS, pursuing degree, knowledge of signal integrity and power

Qualifications

  • 0-2 years of related experience via internships or projects.
  • Pursuing a Bachelor's/Master's/PhD in EE/CS.
  • Coursework in analog and I/O design, DRAM and high-speed interfaces.
  • Understanding electrical systems, signal and power delivery basics.
  • Ability to read specs, datasheets and hardware docs.
  • Strong analytical and communication skills.
  • Experience with AI-enabled tools and LLMs in engineering workflows.

Responsibilities

  • Perform signaling and timing analysis for on-die and off-die interfaces.
  • Develop and evaluate thermal models for memory systems.
  • Analyze power delivery networks, IR-drop and electromigration.
  • Develop modeling, simulation, and automation tools.
  • Collaborate with architecture, design, packaging and tech teams.

Skills

Electrical engineering
Signal integrity
Power integrity
Thermal analysis
Problem solving
Technical communication
AI tools / LLMs usage

Education

Bachelors in Electrical Eng
Masters in Electrical Eng
PhD in CS/EE

Tools

Cadence EDA
MATLAB
Python
Thermal analysis tools
Signal integrity tools

Job description

Micron Technology, Inc. is seeking an HBM Platform Architecture Intern in California to contribute to development of future HBM platforms, evaluating electrical, thermal, and power delivery architectures.

You will work with experienced architects to analyze design trade-offs, develop modeling tools, and push memory system performance, power efficiency, reliability, and scalability. Minimum qualifications include 0-2 years in EE/CS, pursuing degree, knowledge of signal integrity and power

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

HBM Platform Architecture Intern — Next-Gen Memory
HBM Platform Architecture Intern — Next-Gen Memory

Micron • Folsom (CA)

Hybrid
USD 59,000 - 80,000
HBM Platform Architect Intern — AI & HPC Enablement
HBM Platform Architect Intern — AI & HPC Enablement

Micron Technology • Folsom (CA)

On-site
USD 137,760,000 - 151,536,000
HBM Platform Architecture Intern – AI/HPC Focus
HBM Platform Architecture Intern – AI/HPC Focus

Micron Technology, Inc. • Boise (ID)

Hybrid
USD 104,000 - 105,000
Medical, dental and vision plans
Paid time-off
HBM Platform Architecture Intern: Shape Next‑Gen Memory
HBM Platform Architecture Intern: Shape Next‑Gen Memory

1000 Micron Technology, Inc. • Folsom (CA)

On-site
USD 57,000 - 81,000
Medical, dental, vision benefits
Paid time off & holidays
Career development opportunities
HBM Architecture Intern for AI & HPC
HBM Architecture Intern for AI & HPC

Micron Technology • Folsom (CA)

On-site
USD 104,000 - 106,000
Medical Insurance
Dental Insurance
Vision Insurance
+2
HBM Architecture Intern for AI & HPC
HBM Architecture Intern for AI & HPC

Micron Technology, Inc. • Folsom (CA)

On-site
USD 57,000 - 81,000
Medical, dental, vision plans
Paid time off
Holidays
HBM Systems Architect Intern
HBM Systems Architect Intern

1000 Micron Technology, Inc. • Folsom (CA)

On-site
USD 57,000 - 81,000
Medical / Dental / Vision plans
Paid time off
Holidays
HBM Architecture Intern: AI & HPC Innovation
HBM Architecture Intern: AI & HPC Innovation

Micron Technology, Inc. • Folsom (CA), Northern (KY)

Hybrid
USD 69,000 - 83,000
Medical, dental, vision plans
Paid time off
HBM SoC Physical Design Engineer Intern
HBM SoC Physical Design Engineer Intern

1000 Micron Technology, Inc. • Folsom (CA)

On-site
USD 54,000 - 69,000
Medical, dental and vision plans
Paid time off
Paid holidays
HBM Memory Design Engineer Intern
HBM Memory Design Engineer Intern

Micron Technology, Inc. • Richardson (TX)

On-site
USD 34,000 - 55,000
Medical, dental, and vision plans
Paid time off
Paid holidays
+1