HBM Platform Architecture Intern: Shape Next‑Gen Memory

1000 Micron Technology, Inc.; Folsom (CA); On-site; USD 57,000 - 81,000; Full time

Benefits offered by this job

Medical, dental, vision benefits

Paid time off & holidays

Career development opportunities

Job summary

Micron Technology, Inc. seeks an HBM Platform Architecture Intern to analyze electrical, thermal, and power delivery architectures for advanced memory systems.

You will work with experienced architects to evaluate design trade-offs and develop modeling tools that improve performance and efficiency. Responsibilities include signaling analysis, thermal modeling, PDN evaluation, and cross-team collaboration to support future HBM technology development.

Qualifications

• Pursuing a Bachelor’s, Master’s or PhD in Electrical Engineering, Electronics Engineering, Computer Engineering or Computer Science.
• Strong analytic and communications skills are required.
• Coursework in analog I/O, signaling, DRAM or high-speed interfaces is beneficial.
• Experience with AI-enabled tools in engineering workflows is a plus.

Responsibilities

• Perform signaling and timing analysis for on-die and off-die interfaces across system/topology variants.
• Develop and evaluate thermal models for heat transfer and performance.
• Analyze power delivery networks, IR-drop, EM, and power integrity.
• Develop modeling, simulation, and automation tools to support PDN and architecture evaluation.
• Collaborate with multiple teams to evaluate system-level trade-offs for future HBM tech.

Skills

Electrical engineering

Signal integrity

Power integrity

Thermal analysis

VLSI design

AI tools experience

Education

Bachelor’s/Master’s/PhD in Electrical Engineering or related field

Tools

Cadence

MATLAB

thermal analysis tools

signal integrity tools

Python

Job description

Micron Technology, Inc. seeks an HBM Platform Architecture Intern to analyze electrical, thermal, and power delivery architectures for advanced memory systems.

You will work with experienced architects to evaluate design trade-offs and develop modeling tools that improve performance and efficiency. Responsibilities include signaling analysis, thermal modeling, PDN evaluation, and cross-team collaboration to support future HBM technology development.