HBM Platform Architecture Intern – AI/HPC Focus

Micron Technology, Inc.

Boise (ID)

Hybrid

USD 104,000 - 105,000

Full time

12 days ago

Get a reply from this employer

Your resume and cover letter, tailored to exactly what they’re hiring for.

Get past ATS filters

Benefits offered by this job

Medical, dental and vision plans

Paid time-off

Job summary

Micron Technology, Inc. invites applications for an Intern in the HBM Platform Architecture team in Folsom, California.

You will contribute to evaluating electrical, thermal, and power delivery architectures for next-generation memory systems while working with senior architects to analyze design trade-offs and develop modeling tools for performance and reliability improvements. You will collaborate with architecture, design, packaging, and technology teams to support PDKs, PDN optimization, and

Qualifications

0-2 years of relevant experience through internships, research projects, coursework, or academic projects in electrical engineering, VLSI design, signal integrity, power integrity, thermal analysis, semiconductor design, etc.

Responsibilities

Perform signaling and timing analysis for on-die and off-die interfaces across multiple system and packaging topologies.
Develop and evaluate thermal models to analyze heat transfer and design trade-offs in advanced memory systems.
Analyze power delivery networks, including IR-drop and electromigration, for advanced HBM architectures.
Develop modeling, simulation, and automation tools to support power delivery, thermal analysis, and architecture evaluation.
Collaborate with architecture, design, packaging, and technology teams to evaluate system-level trade-offs for future HBM technology development.