HBM Platform Architect Intern — AI & HPC Enablement

Micron Technology; Folsom (CA); On-site; USD 137,760,000 - 151,536,000; Full time

Job summary

Micron Technology is seeking an HBM Platform Architecture Intern in California to analyze electrical, thermal, and power-delivery architectures for advanced memory systems. You will assist in evaluating design trade-offs, build modeling tools, and contribute to performance, power efficiency, reliability, and scalability studies for next-generation memory products.

Work alongside experienced architects across architecture, design, packaging, and technology teams to support system-level evaluation

Qualifications

• 0-2 years of relevant experience through internships, research projects, coursework, or academic projects in electrical engineering, VLSI design, signal integrity, power integrity, thermal analysis, semiconductor design, or related fields.
• Currently pursuing a Bachelor's, Master's, or PhD in Electrical Engineering, Electronics Engineering, Computer Engineering, Computer Science, or a related field.
• Coursework or project experience in analog design, I/O design, signaling, DRAM technologies, high-speed interfaces, packaging, or 2.5D/3D integration technologies.
• Understanding of electrical systems, signal integrity, power delivery, circuit analysis, or semiconductor design fundamentals.
• Ability to read and interpret technical specifications, datasheets, interface standards, and hardware documentation.

Responsibilities

• Perform signaling and timing analysis for on-die and off-die interfaces across multiple system and packaging topologies.
• Develop and evaluate thermal models to analyze heat transfer, thermal performance, and design trade-offs in advanced memory systems.
• Analyze power delivery networks (PDNs), including IR-drop, electromigration, power integrity, and power grid optimization for HBM architectures.
• Develop modeling, simulation, and automation tools to support power delivery, thermal analysis, and architecture evaluation activities.
• Collaborate with architecture, design, packaging, and technology teams to evaluate system-level trade-offs and support future HBM technology development.

Skills

Electrical engineering

Signal integrity

Power integrity

Thermal analysis

VLSI/IC design

AI tool usage

Python

Education

Bachelor's/Master's/PhD in Electrical/Computer Engineering or related

Pursuing degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or Computer Science

Tools

Cadence EDA

MATLAB

Thermal analysis tools

Signal integrity tools

Python

Job description

Micron Technology is seeking an HBM Platform Architecture Intern in California to analyze electrical, thermal, and power-delivery architectures for advanced memory systems. You will assist in evaluating design trade-offs, build modeling tools, and contribute to performance, power efficiency, reliability, and scalability studies for next-generation memory products.

Work alongside experienced architects across architecture, design, packaging, and technology teams to support system-level evaluation