HBM Design Architect - AI-Enabled Memory Architecture

Micron; Richardson (TX); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical plan

Dental plan

Vision plan

Paid time off

Paid holidays

Retirement plan

Job summary

Micron Technology in Texas is seeking an HBM Design Architect to perform first-principles architecture analysis for current and future HBM/DRAM products, including power, PDN, thermal, timing, and area trade-offs. You will run circuit simulations and work with designers to validate architectural options.

You will also develop scripts and automation (Python, Tcl, or similar) to accelerate modeling, simulation setup, and data analysis, collaborating with cross-functional teams to translate

Qualifications

• BSEE or related field with 0-2 years of relevant experience, or MS/PhD with 0-2+ years.
• Solid foundation in CMOS circuit design and device physics.
• Working knowledge of DRAM fundamentals (cell/array operation, sensing, basic timing).
• Understanding of power delivery and power analysis (CV²f, leakage, IR drop) and thermal concepts for semiconductor dies.
• Hands-on experience with circuit simulation (SPICE/HSPICE, FineSim, or equivalent) and Cadence Virtuoso or similar CAD environments
• Proficiency in Python, Tcl, Perl, or another scripting language.

Responsibilities

• Perform architecture-level analysis for HBM/DRAM products, including dynamic and static power, PDN/IR drop, thermal behavior, timing, and area trade-offs.
• Build first-principles models and contributor breakdowns (array, periphery, datapath, I/O, TSV) and correlate them with simulation and silicon data.
• Set up and run circuit simulations (SPICE/HSPICE, FineSim, PrimeSim, Spectre, or equivalent) and associated CAD flows - schematic setup, parasitic extraction, and post-layout simulation - to validate architectural assumptions.
• Assess the impact of new technologies on product metrics, including advanced DRAM nodes, 3D stacking, scaled-pitch hybrid bonding, and BEOL/TSV changes.
• Partner with circuit designers, process technologists, and packaging engineers to develop and quantify architectural solutions.
• Develop scripts, calculators, and automation (Python or equivalent), leveraging AI-assisted workflows (LLMs, Code Assist, agentic AI tools) to accelerate modeling, simulation setup, and data analysis
• Communicate results clearly in architecture reviews and cross-functional working groups

Skills

Python scripting

First-principles thinking

Analytical

Education

BSEE or MS/PhD with 0-2+ years

Tools

Cadence Virtuoso

SPICE/HSPICE

FineSim

PrimeSim

Spectre

Job description

Micron Technology in Texas is seeking an HBM Design Architect to perform first-principles architecture analysis for current and future HBM/DRAM products, including power, PDN, thermal, timing, and area trade-offs. You will run circuit simulations and work with designers to validate architectural options.

You will also develop scripts and automation (Python, Tcl, or similar) to accelerate modeling, simulation setup, and data analysis, collaborating with cross-functional teams to translate