HBM Design Architect — AI-Driven Memory Innovation

Micron Technology, Inc.; Richardson (TX); On-site; USD 140,000 - 220,000; Full time

Benefits offered by this job

Medical plans

Dental plans

Vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. is seeking an HBM Design Architect to drive analysis, modeling, and pathfinding for future High Bandwidth Memory products.

You will evaluate performance, power, area, thermal behavior, reliability, and manufacturability across system and block-level design tradeoffs with AI-assisted techniques. You will collaborate with architecture, circuit design, layout, packaging, product, and system teams to explore innovative memory architectures and ensure scalable,

Qualifications

• Degree in Electrical Engineering, Computer Engineering, or a related field completed prior to the employment start date.
• Strong foundation in CMOS circuits, analog or mixed-signal design, semiconductor devices, computer architecture, memory systems, thermal sciences, signal integrity, power delivery, or advanced packaging.
• Experience developing engineering models, simulations, or analytical methodologies job experience or university-related work.
• Demonstrated ability to evaluate complex technical problems, draw evidence-based conclusions, and communicate recommendations effectively to multidisciplinary teams.
• Strong analytical, problem solving, written communication, and verbal communication skills.

Responsibilities

• Analyze HBM and DRAM architectures using analytical models, simulations, silicon data, and AI-assisted techniques to evaluate timing, bandwidth, power, area, thermal performance, reliability, and design complexity.
• Develop and apply modeling, simulation, and data-analysis methodologies to assess alternative architectural approaches, identify design sensitivities, and support technology pathfinding.
• Collaborate with architecture, circuit design, layout, packaging, product, and system teams to evaluate implementation feasibility, performance tradeoffs, signal integrity, power delivery, and manufacturability considerations.
• Perform root-cause analysis using simulation and measured data to improve model accuracy, validate assumptions, and provide evidence-based design recommendations.
• Communicate technical findings through presentations, design reviews, architecture discussions, and written documentation, clearly articulating assumptions, risks, and recommended actions.

Skills

CMOS circuits

Analog/mixed-signal

Memory systems

Computer architecture

Thermal sciences

Signal integrity

Power delivery

3D integration

Education

Electrical/Computer Engineering degree

Tools

HSPICE

FineSim

Spectre

circuit-design environments

Job description

Micron Technology, Inc. is seeking an HBM Design Architect to drive analysis, modeling, and pathfinding for future High Bandwidth Memory products.

You will evaluate performance, power, area, thermal behavior, reliability, and manufacturability across system and block-level design tradeoffs with AI-assisted techniques. You will collaborate with architecture, circuit design, layout, packaging, product, and system teams to explore innovative memory architectures and ensure scalable,