HBM Design Architect - Next-Gen Memory & AI

Micron Technology, Inc.; Richardson (TX); On-site; USD 120,000 - 190,000; Full time

Benefits offered by this job

Medical benefits

Dental benefits

Vision benefits

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. in Richardson, TX is seeking an HBM Design Architect (E1 to SMTS) to drive analysis, modeling, and pathfinding for next-generation High Bandwidth Memory products.

You will work with architecture, design, and product teams to evaluate performance, power, area, and manufacturability using advanced AI-enabled methods. The role emphasizes collaboration across teams, data-driven decision-making, and applying AI/LLMs for architecture exploration within a leading semiconductor

Qualifications

• Degree in Electrical Engineering, Computer Engineering, or a related field completed prior to start date.
• Strong foundation in CMOS circuits, analog or mixed-signal design, semiconductor devices, memory systems, or related areas.
• Experience developing models, simulations, or analytical methodologies; ability to evaluate complex technical problems.

Responsibilities

• Analyze HBM and DRAM architectures using analytical models, simulations, silicon data, and AI-assisted techniques.
• Develop modeling, simulation, and data-analysis methods to compare architectural approaches.
• Collaborate with architecture, circuit design, layout, packaging, product, and system teams to assess feasibility and tradeoffs.

Skills

CMOS circuits

Analog/mixed-signal design

Memory systems

Computer architecture

Thermal sciences

Signal integrity

Power delivery

Advanced packaging

Education

Electrical Engineering / Computer Engineering degree

Tools

HSPICE

FineSim

Spectre

Job description

Micron Technology, Inc. in Richardson, TX is seeking an HBM Design Architect (E1 to SMTS) to drive analysis, modeling, and pathfinding for next-generation High Bandwidth Memory products.

You will work with architecture, design, and product teams to evaluate performance, power, area, and manufacturability using advanced AI-enabled methods. The role emphasizes collaboration across teams, data-driven decision-making, and applying AI/LLMs for architecture exploration within a leading semiconductor