HBM Design Architecture Intern — AI Memory Systems

Micron Technology, Inc.; Richardson (TX); Hybrid; USD 27,552,000 - 41,328,000; Part time

Benefits offered by this job

Medical/dental/vision plans

Paid time off

Job summary

Micron Technology, Inc. in Richardson, TX is seeking an Intern in Design Architecture to help explore AI memory trends and memory subsystem analysis.

You will work with senior engineers on early-stage research, performance modeling, and tool development related to next-generation HBM architectures. The role involves collecting data on bandwidth and latency, refining simulation frameworks, and building dashboards from industry datasets.

Qualifications

• Currently pursuing a Master’s or PhD in a related field with strong computer architecture foundations.
• Hands-on programming experience in Python and C/C++ is required.
• Ability to learn new tools, frameworks, and data-analysis workflows quickly.

Responsibilities

• Research trends in compute, networking, and storage to anticipate AI workload evolution.
• Support HBM architecture analysis by collecting and synthesizing bandwidth, latency data.
• Assist in developing or refining simulation frameworks for AI cluster models.
• Build trend dashboards using CSP benchmarks and industry datasets.

Skills

Python

C/C++

Data analysis

Education

Master’s or PhD in Electrical Engineering, Computer Engineering, or Computer Science

Job description

Micron Technology, Inc. in Richardson, TX is seeking an Intern in Design Architecture to help explore AI memory trends and memory subsystem analysis.

You will work with senior engineers on early-stage research, performance modeling, and tool development related to next-generation HBM architectures. The role involves collecting data on bandwidth and latency, refining simulation frameworks, and building dashboards from industry datasets.