Global Head of ASIC Physical Design & PPA Strategy

Fidelis Companies

San Francisco (CA)

On-site

USD 190,000 - 280,000

Full time

6 days ago
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Job summary

Fidelis Companies in San Francisco is seeking a senior leader to head global ASIC Physical Design teams responsible for delivering complex digital and mixed-signal ASICs from RTL through GDSII.

The role owns physical design strategy, methodology development, team leadership, and execution across advanced technology nodes, with a focus on aggressive performance, power, and area (PPA) targets to enable successful silicon delivery.

Responsibilities

  • Lead and manage physical design teams across the United States, India, and Italy.
  • Define physical design strategy, technical direction, and execution plans for multiple ASIC programs.
  • Develop and implement advanced physical design methodologies, including Customer Owned Tooling (CoT) flows.
  • Drive all aspects of the physical design flow, including floorplanning, power planning, placement, CTS, routing, timing closure, IR/EM analysis, DRC/LVS, and DFM/DFY.
  • Optimize designs to meet performance, ultra-low power, and area targets on advanced process nodes.
  • Partner with architecture, RTL, DFT, CAD, package, and test teams to support successful silicon execution.
  • Manage EDA vendor and IP provider relationships.
  • Identify project risks and develop mitigation strategies.
  • Oversee resource planning, project schedules, and departmental budgets.
  • Mentor and develop engineering talent while promoting technical excellence and continuous improvement.

Job description

Fidelis Companies in San Francisco is seeking a senior leader to head global ASIC Physical Design teams responsible for delivering complex digital and mixed-signal ASICs from RTL through GDSII.

The role owns physical design strategy, methodology development, team leadership, and execution across advanced technology nodes, with a focus on aggressive performance, power, and area (PPA) targets to enable successful silicon delivery.

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