Director of Advanced Packaging: 2.5D/3D, HBM Leader

Micron Technology, Inc.; Boise (ID); On-site; USD 180,000 - 280,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off and holidays

Paid family leave

Job summary

Micron Technology, Inc. in Boise, Idaho seeks a Director/DMTS, Process Integration Lead for Advanced Packaging (2.5D/3D, HBM) to guide a team developing packaging technologies from concept to full‑scale manufacturing.

You will drive technology development, transfer, and collaboration across design, process, equipment, reliability, test, and manufacturing. You will mentor a high‑caliber team and shape roadmaps for next‑generation packaging platforms, enabling AI‑enabled engineering workflows and

Qualifications

• Bachelor's degree in Materials or Chemical Engineering and 15+ years in advanced packaging tech development.
• Experience with 2.5D/3D stacking and HBM integration; strong interconnect knowledge.
• Experience leading collaborative technical teams and driving large programs.

Responsibilities

• Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms.
• Lead development, optimization, and qualification of emerging packaging technologies via DOE and data analysis.
• Coordinate technology transfer from development to manufacturing and ensure design rule establishment.

Education

Bachelor’s degree in Materials Engineering, Chemical Engineering, or a related field

Master's degree or PhD

Tools

Advanced interconnects

TSVs

Die stacking

Underfill

Molding

Bonding

HBM integration

AI tools for semiconductor development

Job description

Micron Technology, Inc. in Boise, Idaho seeks a Director/DMTS, Process Integration Lead for Advanced Packaging (2.5D/3D, HBM) to guide a team developing packaging technologies from concept to full‑scale manufacturing.

You will drive technology development, transfer, and collaboration across design, process, equipment, reliability, test, and manufacturing. You will mentor a high‑caliber team and shape roadmaps for next‑generation packaging platforms, enabling AI‑enabled engineering workflows and