Advanced Packaging Process Integration Engineer

Micron Technology, Inc.; Boise (ID); Hybrid; USD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. in Boise, Idaho, is seeking a Process Integration Engineer for Advanced Packaging. You will develop and integrate 2.5D/3D packaging, including HBM and hybrid bonding, working across disciplines to improve performance and yield.

Responsibilities include experiments to qualify materials and processes, data-driven yield analysis, and technology transfer to manufacturing. Collaboration with design, process, reliability, and manufacturing teams is essential to deliver

Qualifications

• 8+ years of experience in advanced packaging technology development.
• Experience with 2.5D/3D integration, HBM, and advanced interconnects.
• Experience with design rules, materials selection, and process transfer.

Responsibilities

• Develop and optimize 2.5D/3D packaging, HBM, hybrid bonding, and interconnects.
• Design and execute experiments to qualify materials, flows, and rules for new architectures.
• Analyze yield, performance, and defects to drive process improvements with SPC/analytics.
• Lead technology transfer: qualification, design rules, materials, and manufacturing readiness.
• Warpage engineering: model and mitigate wafer/die warpage; validate with inline metrology.
• Collaborate with cross‑functional teams to deliver high‑performance packaging solutions.

Skills

Advanced packaging experience

2.5D/3D integration

HBM/Hybrid bonding

TSVs/Interconnects

Data analytics/automation

Education

Bachelor’s degree in Materials Engineering or Chemical Engineering or related field

8+ years packaging experience

Job description

Micron Technology, Inc. in Boise, Idaho, is seeking a Process Integration Engineer for Advanced Packaging. You will develop and integrate 2.5D/3D packaging, including HBM and hybrid bonding, working across disciplines to improve performance and yield.

Responsibilities include experiments to qualify materials and processes, data-driven yield analysis, and technology transfer to manufacturing. Collaboration with design, process, reliability, and manufacturing teams is essential to deliver