Advanced Packaging Development Engineer – AI-Driven

1000 Micron Technology, Inc.

Boise (ID)

On-site

USD 85,000 - 125,000

Full time

4 days ago
Be an early applicant

Get a reply from this employer

Your resume and cover letter, tailored to exactly what they’re hiring for.

Get past ATS filters

Benefits offered by this job

Medical benefits
Dental benefits
Vision benefits
Paid time off
Paid holidays

Job summary

Micron Technology, a world leader in memory and storage solutions, seeks a Design Engineer in Boise, Idaho. You will develop and refine Design Rules, requirements, and test structures for advanced packaging, create layout and DBR test vehicles, and ensure robust DRC responses.

You will analyze large datasets, apply AI tools to accelerate development, and collaborate across Process Integration, Product Engineering, Design, and Advanced Mask teams.

Qualifications

  • BS/MS/PhD in Electrical Engineering, Microelectronics, Physics, or related field.

Responsibilities

  • Develop and refine Design Rules, Requirements, and Test Structures for advanced packaging.
  • Create layout and DBR test vehicle and product designs to support technology development.
  • Ensure robust Design Rule Checks (DRC) and appropriate responses to deviations.
  • Analyze large datasets to extract meaningful insights and drive data-driven decision-making.
  • Leverage of artificial intelligence to reduce development time.
  • Manage structure evaluation to support development and quantify process margins.
  • Strategically partner with teams to resolve process issues related to layout and prioritize solutions.
  • Document and communicate complex problem resolutions and drive cross-node design rule alignment.
  • Maintain effective communication across Process Integration, Product Engineering, Design, and Advanced Mask teams.

Skills

Python
R
MATLAB
Cadence Virtuoso
Calibre
HSPICE
Design Rules
Data analysis
CAD collaboration

Education

BS/MS/PhD in Electrical Engineering or related field

Tools

Cadence Virtuoso
Calibre
HSPICE
Python scripting

Job description

Micron Technology, a world leader in memory and storage solutions, seeks a Design Engineer in Boise, Idaho. You will develop and refine Design Rules, requirements, and test structures for advanced packaging, create layout and DBR test vehicles, and ensure robust DRC responses.

You will analyze large datasets, apply AI tools to accelerate development, and collaborate across Process Integration, Product Engineering, Design, and Advanced Mask teams.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Advanced Packaging Design & Layout Engineer (AI-Driven)
Advanced Packaging Design & Layout Engineer (AI-Driven)

Micron Technology, Inc. • Boise (ID)

Hybrid
USD 120,000 - 170,000
Advanced Packaging Design & Layout Engineer (AI-Driven)
Advanced Packaging Design & Layout Engineer (AI-Driven)

Micron Technology, Inc. • Boise (ID)

On-site
USD 110,000 - 150,000
Staff Engineer, Advanced Packaging & Data-Driven Dev
Staff Engineer, Advanced Packaging & Data-Driven Dev

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 120,000 - 160,000
Staff Engineer, Advanced Packaging – AI-Driven Innovation
Staff Engineer, Advanced Packaging – AI-Driven Innovation

Micron • Boise (ID)

On-site
USD 140,000 - 180,000
Medical, Dental, Vision plans
Paid time off
Paid holidays
Process Integration Engineer – Advanced Packaging & AI
Process Integration Engineer – Advanced Packaging & AI

Micron Technology, Inc. • Boise (ID)

Hybrid
USD 110,000 - 150,000
Medical, dental and vision plans
Paid time-off
Paid holidays
+1
Senior Process Development Lead, Advanced Packaging
Senior Process Development Lead, Advanced Packaging

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 180,000 - 240,000
Medical, dental and vision plans
Paid time‑off
Paid holidays
Advanced Packaging Process Integration Engineer
Advanced Packaging Process Integration Engineer

Micron Technology, Inc. • Boise (ID)

Hybrid
USD 120,000 - 180,000
Memory Packaging Architect for Edge & Data Center AI
Memory Packaging Architect for Edge & Data Center AI

Micron Technology, Inc • Boise (ID)

On-site
USD 143,000 - 398,000
Process Engineer, Advanced Packaging for Memory Tech
Process Engineer, Advanced Packaging for Memory Tech

Micron Technology, Inc. • Boise (ID)

Hybrid
USD 90,000 - 130,000
Director, Advanced Packaging Process Integration (2.5D/3D)
Director, Advanced Packaging Process Integration (2.5D/3D)

Micron • Boise (ID)

On-site
USD 180,000 - 240,000
Medical, dental, and vision plans
Paid time off
Paid holidays