Process Integration Engineer – Advanced Packaging & AI

Micron Technology, Inc.; Boise (ID); Hybrid; USD 110,000 - 150,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time-off

Paid holidays

Paid family leave

Job summary

Micron Technology, Inc. is seeking a Process Integration Engineer in Boise, Idaho, to develop and integrate semiconductor processes for memory and advanced packaging, emphasizing wafer-level technology and reconstructed substrates.

You will lead technical projects, design experiments, analyze data, and apply AI tools to improve workflows across engineering functions with a hands-on, collaborative approach.

Qualifications

• BS in Electrical/Chemical/Mechanical Engineering, Materials Science & Engineering, Physics or related field with 5+ years semiconductor experience; MS with 4+ years; or PhD with 2+ years.
• Experience delivering results in process integration, development, or device development with DOE and data-driven analysis.
• Knowledge of DRAM/NAND memory technologies and semiconductor processes.
• Strong problem-solving using data-driven methods and cross-functional leadership.

Responsibilities

• Lead technical integration projects for new memory and advanced packaging technologies.
• Design and complete experiments to assess process performance, variability, reliability, and yield.
• Solve complex issues using inline, defect, parametric, probe, reliability, and package testing data.
• Collaborate across multiple teams to develop and qualify new technologies.
• Apply AI tools to data analysis, planning, documentation, and problem-solving.

Skills

Data analysis

Experiment design

Project leadership

Cross-functional collaboration

AI tools in engineering

Education

BS in Electrical/ Chemical/ Mechanical Engineering, Materials Science & Engineering, Physics

MS in related field or PhD (with semiconductor experience)

Tools

Statistical analysis software

AI/ML data analysis tools

Job description

Micron Technology, Inc. is seeking a Process Integration Engineer in Boise, Idaho, to develop and integrate semiconductor processes for memory and advanced packaging, emphasizing wafer-level technology and reconstructed substrates.

You will lead technical projects, design experiments, analyze data, and apply AI tools to improve workflows across engineering functions with a hands-on, collaborative approach.