Lead 3DIC Packaging & Hybrid Bonding

NanoHelp; Boise (ID); On-site; USD 140,000 - 200,000; Full time

Benefits offered by this job

Collaborative work culture

Healthcare plans

Paid time off

Global learning opportunities

Long-term career development

Job summary

A leading technology firm in Boise, Idaho, is seeking a DMTS Process Integration Engineer to spearhead next-generation 3DIC and hybrid bonding integrations in advanced memory packaging. Ideal candidates will have an advanced degree in engineering or related fields, with robust experience in DRAM, NAND, and yield optimization. This senior role requires strong leadership and analytical skills in a dynamic, innovative environment. Competitive salary with comprehensive benefits is offered.

Qualifications

• Expert in semiconductor process integration with focus on 3DIC and hybrid bonding.
• Strong analytical and problem-solving skills.
• Ability to work in fast-paced, high-tech environments.

Responsibilities

• Lead process integration efforts in advanced packaging innovations.
• Develop yield improvement plans and statistical process controls.
• Mentor early-career engineers and present findings to teams.

Skills

Advanced Packaging

DRAM

NAND

3DIC

Hybrid bonding

Data analysis

Leadership

Communication

Education

MS or PhD in Engineering, Physics, Chemistry or related fields

Tools

JMP/system tools

Job description

A leading technology firm in Boise, Idaho, is seeking a DMTS Process Integration Engineer to spearhead next-generation 3DIC and hybrid bonding integrations in advanced memory packaging. Ideal candidates will have an advanced degree in engineering or related fields, with robust experience in DRAM, NAND, and yield optimization. This senior role requires strong leadership and analytical skills in a dynamic, innovative environment. Competitive salary with comprehensive benefits is offered.