Advanced Semiconductor Package Designer (2.5D/3D)

SK hynix America; San Jose (CA); On-site; USD 110,000 - 155,000; Full time

Benefits offered by this job

Top-tier health insurance

401k Matching

Flexible Spending Account (FSA)

Educational reimbursement up to $10,0

Donation Matching and volunteering

Free Breakfast/Lunch/Dinner

Job summary

SK hynix America is seeking a Package Designer to join our Packaging Engineering team. You will design and optimize high-density semiconductor packages for next-generation products, collaborating with PCB, SI/PI, thermal, and manufacturing teams to ensure manufacturability and cost-effectiveness.

You will work with advanced packaging technologies such as 2.5D/3D, use Cadence Allegro/Virtuoso/Innovus and other tools to create layouts, perform SI/PI analyses, and help establish design rules and

Qualifications

• Bachelor’s or Master’s degree in Electrical or Mechanical Engineering or Materials Science.
• Minimum 3+ years of semiconductor package design or layout experience.
• Experience with high-speed signaling and PDN design.

Responsibilities

• Design and layout of advanced semiconductor packages including Flip Chip, BGA, LGA, 2.5D/3D integration with HBM.
• Use Cadence Allegro/Virtuoso/Innovus, Siemens Xpedition, Synopsys 3D-ICC to create and verify layouts.
• Perform SI and PI analysis with SI/PI engineers.
• Develop design rules, stack-ups, and layout guidelines.
• Collaborate with internal and external stakeholders on packaging tech development.

Skills

Package design

EDA tools

Signal Integrity

PDN design

Cross-functional collaboration

Communication skills

Education

Bachelor's/Master's in Electrical Engineering or related field

Tools

Cadence Allegro/Virtuoso/Innovus

Siemens Xpedition

Synopsys 3D-ICC

AutoCAD

Ansys HFSS/ADS

Job description

SK hynix America is seeking a Package Designer to join our Packaging Engineering team. You will design and optimize high-density semiconductor packages for next-generation products, collaborating with PCB, SI/PI, thermal, and manufacturing teams to ensure manufacturability and cost-effectiveness.

You will work with advanced packaging technologies such as 2.5D/3D, use Cadence Allegro/Virtuoso/Innovus and other tools to create layouts, perform SI/PI analyses, and help establish design rules and