Advanced Package Design Engineer

SK hynix America; San Jose (CA); On-site; USD 110,000 - 155,000; Full time

Benefits offered by this job

Top Tier health insurance at no employee cost

Paid time off (PTO) + Company Holidays + Happy Fridays

Paid Parental Leave Program

401k Matching

Educational reimbursement up to $10,000 per year

Donation Matching and volunteering opportunities

Free Breakfast/Lunch/Dinner provided to employees

Job summary

A leading semiconductor firm in San Jose, CA is seeking an Advanced Package Design Engineer. This role involves designing and optimizing high-performance, high-density interposers for chiplet-based architectures. The ideal candidate should have at least 3 years of experience in semiconductor package design, particularly with relevant layout tools. Strong collaboration with PCB and manufacturing teams is essential. The company offers competitive compensation and a comprehensive benefits package including top-tier health insurance and educational reimbursement.

Qualifications

• 3+ years of experience in semiconductor package design or layout.
• Proven experience with layout tools Virtuoso/APD, Synopsys Custom Compiler, and Siemens Xpedition.
• Familiar with 2.5D/3D packaging technologies and substrate design rules.

Responsibilities

• Design silicon and organic interposers for advanced packaging solutions.
• Perform design studies and scenario analysis to optimize package design.
• Collaborate with stakeholders to ensure seamless packaging technology development.

Skills

EDA tools (Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition)

High-speed signal routing

Power distribution networks (PDN)

Effective communication

Education

Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, or Material Science

Tools

Ansys

HFSS

ADS

Job description

Job Title: Advanced Package Design Engineer

Office Location: San Jose, CA

Work Model: Onsite

About SK hynix America

At SK hynix America, we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape.
We're looking for innovative minds to join our mission of shaping the future of technology. At SK hynix America, you'll be part of a team that's pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We're not just adapting to technological change – we're driving it, with significant investments in artificial intelligence, machine learning, and eco-friendly solutions and operational practices. As we continue to expand our market presence and push the boundaries of what's possible in semiconductor technology, we invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing.

Job Summary

We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density Interposers for chiplet-based architectures and heterogeneous integration solutions. You’ll collaborate closely with PCB, SI/PI, thermal, and manufacturing teams to deliver robust, manufacturable, and cost-effective package solutions

Responsibilities

• Design silicon and organic interposers for advanced packaging solutions
• Experience in EDA tools such as Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition to create and verify advanced package layouts
• Perform design studies and what if scenario analysis for advanced packaging schemes to optimize the overall package design.
• Create and maintain layout design rules, stack-ups, and layout guidelines
• Collaborate with internal and external stakeholders to ensure seamless advanced packaging technology development

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering (Preferred), Mechanical Engineering, Material Science, or a related field.
• 3+ years of experience in semiconductor package design or layout
• Proven experience with layout tools Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition
• Understanding of high-speed signal routing, power distribution networks (PDN)
• Familiar with 2.5D/3D packaging technologies, substrate design rules, and large body substrate technologies
• Effective communication skills and ability to work in a fast-paced, cross-functional environment

Preferred Qualifications

• Currently pursuing a PhD's degree in Electrical Engineering or a related field
• 5+ years of experiences in advanced packaging layout design
• Experience with SI/PI simulation tools (Ansys, HFSS, ADS)
• Proven understanding of high-speed signal routing, power distribution networks (PDN)
• Proven technical understanding of advanced packaging materials, their interactions, failure mechanisms and analytical techniques
• Top Tier health insurance at no employee cost
• Paid day offs: PTO + Company Holidays + Happy Fridays
• Paid Parental Leave Program
• 401k Matching
• Educational reimbursement up to $10,000 per year
• Donation Matching and volunteering opportunities
• Free Breakfast/Lunch/Dinner provided to employees

Compensation

Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process.

Pay Range

$110,000 - $155,000 USD

SKHYA is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information or any other status protected under federal, state, or local applicable laws.