Package Designer

SK hynix America; San Jose (CA); On-site; USD 110,000 - 155,000; Full time

Benefits offered by this job

Top-tier health insurance

401k Matching

Flexible Spending Account (FSA)

Educational reimbursement up to $10,0

Donation Matching and volunteering

Free Breakfast/Lunch/Dinner

Job summary

SK hynix America is seeking a Package Designer to join our Packaging Engineering team. You will design and optimize high-density semiconductor packages for next-generation products, collaborating with PCB, SI/PI, thermal, and manufacturing teams to ensure manufacturability and cost-effectiveness.

You will work with advanced packaging technologies such as 2.5D/3D, use Cadence Allegro/Virtuoso/Innovus and other tools to create layouts, perform SI/PI analyses, and help establish design rules and

Qualifications

• Bachelor’s or Master’s degree in Electrical or Mechanical Engineering or Materials Science.
• Minimum 3+ years of semiconductor package design or layout experience.
• Experience with high-speed signaling and PDN design.

Responsibilities

• Design and layout of advanced semiconductor packages including Flip Chip, BGA, LGA, 2.5D/3D integration with HBM.
• Use Cadence Allegro/Virtuoso/Innovus, Siemens Xpedition, Synopsys 3D-ICC to create and verify layouts.
• Perform SI and PI analysis with SI/PI engineers.
• Develop design rules, stack-ups, and layout guidelines.
• Collaborate with internal and external stakeholders on packaging tech development.

Skills

Package design

EDA tools

Signal Integrity

PDN design

Cross-functional collaboration

Communication skills

Education

Bachelor's/Master's in Electrical Engineering or related field

Tools

Cadence Allegro/Virtuoso/Innovus

Siemens Xpedition

Synopsys 3D-ICC

AutoCAD

Ansys HFSS/ADS

Job description

At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations.We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.

Work Model: Onsite

Job Summary:

We are seeking a skilled Package Designer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density semiconductor packages for next-generation semiconductor products. You’ll collaborate closely with PCB, SI/PI, thermal, and manufacturing teams to deliver robust, manufacturable, and cost-effective package solutions.

Responsibilities:

• Design and layout of advanced semiconductor packages including Flip Chip, BGA, LGA, 2.5D/3D heterogeneous integration with High Bandwidth Memory (HBM)
• Use EDA tools (Cadence Allegro/Virtuoso/Innovus, Siemens Xpedition, Synopsys 3D-ICC etc.) to create and verify package layouts
• Perform Signal Integrity (SI) and Power Integrity (PI) analysis in collaboration with SI/PI engineers
• Perform design and what-if scenario analysis for novel advanced packaging schemes to improve system-in-package (SIP) performance.
• Create and maintain design rules, stack-ups, and layout guidelines
• Collaborate with internal and external stakeholders to ensure seamless advanced packaging technology development

Minimum Qualifications:

• Bachelor’s or Master’s degree in Electrical Engineering (Preferred), Mechanical Engineering, Materials Science, or a related field
• 3+ years of experience in semiconductor package design or layout
• Proven experience with package layout tools (Cadence Allegro/Virtuoso/Innovus, Siemens Xpedition, Synopsys 3D-ICC, Autocad or equivalent)
• Strong understanding of high-speed signal routing and power distribution networks (PDN)
• In-depth knowledge in 2.5D/3D packaging technologies, substrate design rules, and large body substrate technologies
• Effective communication skills and ability to work in a fast-paced, cross-functional environment

Preferred Qualifications:

• Currently pursuing a PhD's degree in Electrical Engineering or a related field
• 5+ years of experiences in advanced packaging technology development and manufacturing
• Experience with SI/PI simulation tools (Ansys, HFSS, ADS)
• Proven technical understanding of advanced packaging materials, their interactions, failure mechanisms and analytical techniques
• Top Tier health insurance at no employee cost
• Paid day offs: Paid Time Off, Company Holidays, Parental Leave, Happy Fridays
• 401k Matching
• Flexible Spending Account (FSA) for Health Care &Dependent Care
• Educational reimbursement up to $10,000 per year
• Donation Matching and volunteering opportunities
• Free Breakfast/Lunch/Dinner provided to employees

Compensation:

Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process.

Pay Range

$110,000 - $155,000 USD

SK hynix America is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information, or any other status protected under federal, state, or local applicable laws.

In compliance with federal law, SK hynix America also participates in the federal E-Verify program. Upon accepting an offer of employment, all newly hired individuals will be required to complete Form I-9, which includes verifying identity and legal authorization to work in the United States. Please review the official government posters detailing your rights and protections prior to applying:

Voluntary Self-Identification

For government reporting purposes, we ask candidates to respond to the below self-identification survey.Completion of the form is entirely voluntary. Whatever your decision, it will not be considered in the hiringprocess or thereafter. Any information that you do provide will be recorded and maintained in aconfidential file.

As set forth in SK hynix America’s Equal Employment Opportunity policy,we do not discriminate on the basis of any protected group status under any applicable law.

If you believe you belong to any of the categories of protected veterans listed below, please indicate by making the appropriate selection.As a government contractor subject to the Vietnam Era Veterans Readjustment Assistance Act (VEVRAA), we request this information in order to measurethe effectiveness of the outreach and positive recruitment efforts we undertake pursuant to VEVRAA. Classification of protected categoriesis as follows:

A "disabled veteran" is one of the following: a veteran of the U.S. military, ground, naval or air service who is entitled to compensation (or who but for the receipt of military retired pay would be entitled to compensation) under laws administered by the Secretary of Veterans Affairs; or a person who was discharged or released from active duty because of a service-connected disability.

A "recently separated veteran" means any veteran during the three-year period beginning on the date of such veteran's discharge or release from active duty in the U.S. military, ground, naval, or air service.

An "active duty wartime or campaign badge veteran" means a veteran who served on active duty in the U.S. military, ground, naval or air service during a war, or in a campaign or expedition for which a campaign badge has been authorized under the laws administered by the Department of Defense.

An "Armed forces service medal veteran" means a veteran who, while serving on active duty in the U.S. military, ground, naval or air service, participated in a United States military operation for which an Armed Forces service medal was awarded pursuant to Executive Order 12985.