Principal SIPI Engineer — 3D Packaging & HBM Expert

SK hynix America; San Jose (CA); On-site; USD 185,000 - 220,000; Full time

Benefits offered by this job

Top Tier health insurance

Paid time off + holidays

401k Matching

Educational reimbursement

Volunteer opportunities

Corporate discounts

Onsite meals provided

Job summary

SK hynix America is hiring a Principal Engineer to lead SIPI strategy for next‑gen packaging and HBM integration. You’ll drive architecture, validation, and sign‑off across the full stack from silicon to substrate in collaboration with global R&D teams.

The role demands deep experience in high‑speed interfaces, EM extraction, and industry standards, with a track record of guiding multi‑disciplinary teams to deliver robust packaging solutions.

Qualifications

• PhD or MS with extensive SIPI/packaging experience.
• Deep knowledge of 2.5D/3D packaging, HBM and interposers.
• Strong electronics design and verification background.

Responsibilities

• Define and own SIPI roadmap for advanced PKG families.
• Lead high‑performance SiP architectures across stack from silicon to substrate.
• Develop SIPI methodologies: EM extraction, multi‑port S‑parameters, PI analysis.
• Oversee end‑to‑end design flow: definition, simulation, layout sign‑off, tape‑out.
• Mentor engineers and drive cross‑team knowledge sharing.
• Conduct risk assessments and deliver SIPI sign‑off packages.

Skills

2.5D/3D packaging

HBM knowledge

SIPI signal integrity

Power integrity

Leadership

Mentorship

Communication

Education

Ph.D. in Electrical Engineering

Masters + 5 years related experience

Tools

Ansys SIwave

RedHawk

Cadence Sigrity

Job description

SK hynix America is hiring a Principal Engineer to lead SIPI strategy for next‑gen packaging and HBM integration. You’ll drive architecture, validation, and sign‑off across the full stack from silicon to substrate in collaboration with global R&D teams.

The role demands deep experience in high‑speed interfaces, EM extraction, and industry standards, with a track record of guiding multi‑disciplinary teams to deliver robust packaging solutions.