Senior Electro-Thermal Packaging Engineer (Chiplet 2.5D/3D)

Eliyan Corporation; San Francisco (CA); On-site; USD 120,000 - 160,000; Full time

Benefits offered by this job

Excellent benefits

Fun work environment

Job summary

Eliyan Corporation is looking for a Senior/Staff Packaging Engineer to join our innovative chiplet interconnect team in San Francisco, CA. You will focus on developing simulations for next-gen semiconductor packaging, including 2.5D/3D IC integration.

The ideal candidate has a PhD in Engineering, strong analytical skills, and hands-on experience with tools like ANSYS and Cadence. We offer a collaborative and fun work environment with competitive benefits.

Qualifications

• PhD in relevant field focusing on thermal management or electronic packaging.
• Strong academic background in power integrity and thermal management.
• Expert proficiency in EDA tools for simulation.

Responsibilities

• Develop detailed thermal models for advanced packaging.
• Conduct power integrity and electromigration analysis.
• Collaborate on design-for-reliability initiatives.

Skills

Electro-thermal simulation

Python scripting

ANSYS RedHawk-SC

Power integrity analysis

Thermal management

C/C++ programming

Education

PhD in Electrical/Mechanical Engineering

Master's with 5+ years experience

Tools

Cadence Sigrity/Clarity

Synopsys RedHawk Fusion

HFSS

Job description

Eliyan Corporation is looking for a Senior/Staff Packaging Engineer to join our innovative chiplet interconnect team in San Francisco, CA. You will focus on developing simulations for next-gen semiconductor packaging, including 2.5D/3D IC integration.

The ideal candidate has a PhD in Engineering, strong analytical skills, and hands-on experience with tools like ANSYS and Cadence. We offer a collaborative and fun work environment with competitive benefits.