Advanced Packaging: Process Integration Intern

Micron Technology, Inc.; Boise (ID); On-site; USD 30,000 - 39,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. in Boise, Idaho is seeking an Advanced Package TD Process Integration Intern to support development of interconnect technologies and packaging solutions.

You will gain hands-on experience in experimental design, data analysis, and problem solving to contribute to yield improvement and process optimization, working with experienced engineers and global teams. This internship emphasizes hands-on learning and collaboration in a fast-paced semiconductor environment.

Qualifications

• Pursuing a bachelor's degree in a relevant field with graduation after Fall 2026.
• Strong data extraction, analysis, and reporting skills using JMP or similar tools.
• Excellent collaboration and communication across multi-functional teams required.

Responsibilities

• Lead problem-solving activities using KT and structured methods.
• Define and implement DoE for process development.
• Present results to local and global partners and document outcomes.
• Support line monitoring and yield improvement initiatives.
• Develop new line monitoring methods and define key metrics.
• Conduct experiments with Micron systems and analyze results.

Skills

Data extraction & analysis

Collaboration & communication

Structured problem solving

Education

Pursuing BS in EE / Materials Science or related field

Tools

JMP

Job description

Micron Technology, Inc. in Boise, Idaho is seeking an Advanced Package TD Process Integration Intern to support development of interconnect technologies and packaging solutions.

You will gain hands-on experience in experimental design, data analysis, and problem solving to contribute to yield improvement and process optimization, working with experienced engineers and global teams. This internship emphasizes hands-on learning and collaboration in a fast-paced semiconductor environment.