Advanced Packaging Metrology Engineer – On‑Site

Intel Corporation

Phoenix (AZ)

Hybrid

USD 134,000 - 189,000

Full time

14 days+
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Benefits offered by this job

Stock bonuses
Health insurance
Vacation

Job summary

Intel Corporation's Advanced Packaging Technology and Manufacturing (APTM) seeks a Metrology Equipment Engineer to drive process control, manufacturing data analytics and yield improvement for Thermal Compression Bonding technologies. You will develop and sustain metrology systems and inspection equipment to support Intel's roadmap for advanced packaging.

The role emphasizes DOE, MSA, data analysis with Python/Excel/SQL, and collaboration with suppliers and internal teams to ensure data

Qualifications

  • Bachelor's degree in Electrical/Mechanical/Physics/Metrology with 4+ years, or Master's 3+ years, or PhD 1+ year in a related engineering discipline.
  • 1+ years hands-on metrology systems development or calibration in manufacturing, lab, or engineering environments.
  • 2+ years knowledge of MSA including bias, linearity, stability, repeatability and reproducibility.
  • 2+ years experience with electrical measurements (continuity, resistance, leakage, signal integrity).
  • 2+ years experience with optical metrology (microscopes, imaging, inspection or machine vision).
  • 2+ years experience with data analysis tools (Python, Excel, SQL).

Responsibilities

  • Optimizes metrology capability across lab and manufacturing environments by developing and qualifying measurement processes and calibration methods.
  • Applies DOE and statistical analysis to improve repeatability and data integrity across tools and sites.
  • Documents technical findings through white papers, reports and qualification summaries.
  • Collaborates with equipment suppliers and internal teams to ensure measurement capability and traceability for programs.
  • Provides technical consultation on measurement challenges and metrology process improvements.
  • Supports standardization of metrology methods with packaging technology development and partner groups.

Skills

Metrology engineering
Statistical analysis
MSA methods
Data analytics

Education

Bachelor's degree in Electrical/Mechanical/Physics/Metrology
Master's degree or PhD in related field

Tools

Python
Excel
SQL

Job description

Intel Corporation's Advanced Packaging Technology and Manufacturing (APTM) seeks a Metrology Equipment Engineer to drive process control, manufacturing data analytics and yield improvement for Thermal Compression Bonding technologies. You will develop and sustain metrology systems and inspection equipment to support Intel's roadmap for advanced packaging.

The role emphasizes DOE, MSA, data analysis with Python/Excel/SQL, and collaboration with suppliers and internal teams to ensure data

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