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Intel Corporation's Advanced Packaging Technology and Manufacturing (APTM) seeks a Metrology Equipment Engineer to drive process control, manufacturing data analytics and yield improvement for Thermal Compression Bonding technologies. You will develop and sustain metrology systems and inspection equipment to support Intel's roadmap for advanced packaging.
The role emphasizes DOE, MSA, data analysis with Python/Excel/SQL, and collaboration with suppliers and internal teams to ensure data
Intel Corporation's Advanced Packaging Technology and Manufacturing (APTM) seeks a Metrology Equipment Engineer to drive process control, manufacturing data analytics and yield improvement for Thermal Compression Bonding technologies. You will develop and sustain metrology systems and inspection equipment to support Intel's roadmap for advanced packaging.
The role emphasizes DOE, MSA, data analysis with Python/Excel/SQL, and collaboration with suppliers and internal teams to ensure data