Senior Thermal & Packaging Research Engineer

Intel Corporation; Phoenix, Northern (AZ, KY); Hybrid; USD 164,000 - 232,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plans

Vacation

Job summary

Intel Corporation in Phoenix, AZ is seeking a Thermal Analysis Engineer to drive research on advanced semiconductor devices, packages, and interconnects. You will design, fabricate, and test prototypes, applying device physics and thermomechanical analysis to optimize performance and cost.

The role requires hands-on experimentation, collaboration across device, reliability, and fabrication teams, and expertise in DOE, simulations (Ansys/Abaqus), and programming (Python/MATLAB).

Qualifications

• Bachelor’s degree or higher in a related engineering/physical science field.
• 6+ years with a bachelor’s; 4+ years with a master’s; 2+ years with a PhD.
• Advanced experience in semiconductor fabrication processes and packaging design methodologies.
• Experience with simulation tools (Ansys/Abaqus) and programming (Python/MATLAB).

Responsibilities

• Conduct research using device physics, thermomechanical analysis, and materials science for novel devices and systems.
• Design and fabricate prototypes to demonstrate proof-of-concept packaging and interconnect technologies.
• Perform electrical testing and establish methodologies for device characterization (DC, RF, pulsing, stressing).
• Develop process solutions across lithography, etch, diffusion, CVD, PVD, CMP to address challenges.
• Plan experiments with device, reliability, and fabrication teams; benchmark against industry standards.
• Engage with external vendors and researchers to support collaborations and Intel’s pipeline.

Skills

Analytical thinking

Problem solving

Communication

Leadership

Education

Bachelor’s or higher in Electrical Engineering / Physics / Materials Science / Mechanical Engineering

Tools

Ansys

Abaqus

Python

MATLAB

Job description

Intel Corporation in Phoenix, AZ is seeking a Thermal Analysis Engineer to drive research on advanced semiconductor devices, packages, and interconnects. You will design, fabricate, and test prototypes, applying device physics and thermomechanical analysis to optimize performance and cost.

The role requires hands-on experimentation, collaboration across device, reliability, and fabrication teams, and expertise in DOE, simulations (Ansys/Abaqus), and programming (Python/MATLAB).