Senior Manager, Advanced Packaging Metrology

Intel Corporation; Hillsboro, Northern (OR, KY); Hybrid; USD 156,000 - 255,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Paid time off

Job summary

Intel Corporation in Hillsboro, Oregon seeks an Advanced Packaging Metrology Engineering Manager to lead a high-performing team. You will drive wafer-level packaging innovation, enable manufacturing readiness, and steer long-term technology strategies across global sites.

The role requires building strong cross-functional partnerships and mentoring engineers to excel in a fast-paced environment. You will champion safety, quality, and cost while pushing the boundaries of semiconductor technology,

Qualifications

• Bachelor’s degree in science/engineering with 6+ years of relevant experience OR Master’s degree with 4+ years OR PhD with 4+ years.
• Experience in metrology area and wafer-level packaging development.
• Leadership experience in a managerial role within semiconductor manufacturing.

Responsibilities

• Lead and inspire a team of engineers to develop advanced wafer processing and packaging solutions.
• Drive technology enablement and matrixed program leadership aligned with Intel's roadmap.
• Ensure demonstrations of manufacturing capabilities at high volumes and manage tech transfers to global sites.
• Collaborate with cross-functional teams to deliver robust process solutions meeting device specs while controlling cost.

Skills

Metrology

People management

Wafer-level packaging

Process development

Hybrid bonded interconnects

RDL packaging

High-volume production leadership

Education

Bachelor’s degree in science/engineering

Master’s degree in related STEM field

PhD in related STEM field

Job description

Intel Corporation in Hillsboro, Oregon seeks an Advanced Packaging Metrology Engineering Manager to lead a high-performing team. You will drive wafer-level packaging innovation, enable manufacturing readiness, and steer long-term technology strategies across global sites.

The role requires building strong cross-functional partnerships and mentoring engineers to excel in a fast-paced environment. You will champion safety, quality, and cost while pushing the boundaries of semiconductor technology,