Advanced Packaging Metrology Engineering Leader
Intel Corporation
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Vantaggi offerti da questo lavoro
Descrizione del lavoro
Intel Corporation in Hillsboro, Oregon seeks an Advanced Packaging Metrology Engineering Manager to lead a high‑performing team advancing wafer-level packaging technologies. You will drive feasibility studies, enable manufacturing readiness, and manage technology transfers to global sites.
The role emphasizes strategic leadership, collaboration, and strong communication to push semiconductor innovation forward.
Competenze
- Bachelor’s degree in science, engineering, or related STEM field with 6+ years of experience, or Master’s with 4+ years, or PhD with 4+ years.
- Experience in semiconductor wafer or assembly, process development, and project execution.
- Leadership experience in managerial roles within a engineering or R&D setting.
Mansioni
- Lead a team of engineers to develop advanced wafer processing and packaging solutions.
- Drive technology enablement, feasibility studies, and module improvements.
- Ensure demonstrations at high volume and manage transfers to global manufacturing sites.
- Collaborate with cross-functional teams to deliver process solutions meeting device specs.
Conoscenze
Formazione
Strumenti
Descrizione del lavoro
Intel Corporation in Hillsboro, Oregon seeks an Advanced Packaging Metrology Engineering Manager to lead a high‑performing team advancing wafer-level packaging technologies. You will drive feasibility studies, enable manufacturing readiness, and manage technology transfers to global sites.
The role emphasizes strategic leadership, collaboration, and strong communication to push semiconductor innovation forward.
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