Senior Advanced Packaging Process Integration Engineer
Intel Corporation
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Benefits offered by this job
Job summary
Intel Corporation in Albuquerque, New Mexico is hiring a Process Integration Engineer within our APTM Silicon Manufacturing Technology Development organization in Rio Rancho. You will enable the advanced packaging roadmap, develop upcoming technology nodes, and ensure processes are robust for high-volume manufacturing.
Collaborate with module teams, device and reliability engineers, and packaging teams to close defect and yield gaps, drive cross-functional transfers, and deliver base die
Qualifications
- Bachelor’s degree in engineering, material science, physics, or related field with 3+ years of relevant experience or Master’s with 2+ years or PhD with no prior experience.
- Experience in technology development or high-volume manufacturing environments.
- Experience with advanced packaging techniques and flows.
Responsibilities
- Enable Intel's advanced packaging roadmap by developing and qualifying upcoming technology nodes.
- Own and drive closure of defect, yield, reliability, and device entitlement gaps across processes under development.
- Collaborate with process module teams to support readiness reviews and transfer milestones.
- Partner with device, yield, reliability, and packaging teams to deliver robust base die solutions.
- Participate in value engineering to identify cost-effective solutions while maintaining quality.
Skills
Education
Tools
Job description
Intel Corporation in Albuquerque, New Mexico is hiring a Process Integration Engineer within our APTM Silicon Manufacturing Technology Development organization in Rio Rancho. You will enable the advanced packaging roadmap, develop upcoming technology nodes, and ensure processes are robust for high-volume manufacturing.
Collaborate with module teams, device and reliability engineers, and packaging teams to close defect and yield gaps, drive cross-functional transfers, and deliver base die
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