Packaging Module Development Engineer

Intel Corporation; Phoenix (AZ); Hybrid; USD 134,000 - 189,000; Full time

Benefits offered by this job

Stock bonuses

Health insurance

Vacation

Job summary

Intel Corporation's Advanced Packaging Technology and Manufacturing (APTM) seeks a Metrology Equipment Engineer to drive process control, manufacturing data analytics and yield improvement for Thermal Compression Bonding technologies. You will develop and sustain metrology systems and inspection equipment to support Intel's roadmap for advanced packaging.

The role emphasizes DOE, MSA, data analysis with Python/Excel/SQL, and collaboration with suppliers and internal teams to ensure data

Qualifications

• Bachelor's degree in Electrical/Mechanical/Physics/Metrology with 4+ years, or Master's 3+ years, or PhD 1+ year in a related engineering discipline.
• 1+ years hands-on metrology systems development or calibration in manufacturing, lab, or engineering environments.
• 2+ years knowledge of MSA including bias, linearity, stability, repeatability and reproducibility.
• 2+ years experience with electrical measurements (continuity, resistance, leakage, signal integrity).
• 2+ years experience with optical metrology (microscopes, imaging, inspection or machine vision).
• 2+ years experience with data analysis tools (Python, Excel, SQL).

Responsibilities

• Optimizes metrology capability across lab and manufacturing environments by developing and qualifying measurement processes and calibration methods.
• Applies DOE and statistical analysis to improve repeatability and data integrity across tools and sites.
• Documents technical findings through white papers, reports and qualification summaries.
• Collaborates with equipment suppliers and internal teams to ensure measurement capability and traceability for programs.
• Provides technical consultation on measurement challenges and metrology process improvements.
• Supports standardization of metrology methods with packaging technology development and partner groups.

Skills

Metrology engineering

Statistical analysis

MSA methods

Data analytics

Education

Bachelor's degree in Electrical/Mechanical/Physics/Metrology

Master's degree or PhD in related field

Tools

Python

Excel

SQL

Job description

Job Details: Job Description

The Advanced Packaging Technology and Manufacturing (APTM) organization is seeking a Metrology Equipment Engineer to drive process control, manufacturing data analytics, and yield improvement for Thermal Compression Bonding (TCB) technologies. The successful candidate develops and sustains metrology systems, measurement methods, and inspection equipment to support Intel's roadmap for advanced packaging and Thermal Compression Bonding technologies. They apply engineering principles and novel concepts to deliver measurement solutions that improve process control, product quality, reliability, productivity, yield, and manufacturability.

Key Responsibilities

• Optimizes metrology capability across laboratory and manufacturing environments by developing and qualifying measurement processes, equipment specifications, calibration methods, and correlation techniques.
• Uses design of experiments, statistical analysis, and measurement system analysis to improve repeatability, reproducibility, and consistency across tools, sites, and product generations.
• Documents technical findings and improvements through white papers, reports, and qualification summaries.
• Establishes measurement specifications and collaborates with equipment suppliers, internal development teams, quality, process, and manufacturing organizations to ensure measurement capability, traceability, and data integrity meet program needs.
• Provides technical consultation on measurement challenges, equipment issues, lab-to-factory correlation, and metrology process improvements.
• Supports standardization of metrology methods, and works closely with packaging technology development, process engineering, and partner engineering groups to assess readiness and meet product milestones.

Qualifications

• Minimum requirements: Bachelor's degree with 4+ years or Master's degree with 3+ years, or PhD with 1+ years of relevant experience in Electrical Engineering, Mechanical Engineering, Physics, Metrology, Instrumentation, Optical Engineering, or a related engineering discipline.
• 1+ years of hands-on experience in metrology systems development, measurement equipment qualification, calibration, and/or measurement method development in a manufacturing, lab, or engineering environment.
• 2+ years of knowledge of measurement system analysis (MSA), including bias, linearity, stability, repeatability, and reproducibility.
• 2+ years of experience with electrical measurements and test, such as continuity, resistance, leakage, signal integrity basics, or related parametric test methods.
• 2+ years of experience with optical metrology, including microscopes, imaging systems, inspection methods, and/or machine vision.
• 2+ years of working knowledge of data analysis tools such as Python, Excel, SQL, or similar tools for measurement analysis and reporting.

Preferred Qualifications

• Experience in semiconductor manufacturing, preferably in advanced packaging.
• Experience developing or sustaining metrology systems for process control, product qualification, or reliability evaluation.
• Strong background in equipment selection, tool qualification, acceptance testing, and calibration traceability.
• Experience with machine vision systems, automated inspection, or camera-based measurement techniques.
• Familiarity with lab-to-factory correlation, tool matching, and cross-tool measurement agreement studies.
• Experience with DOE, correlation analysis, and method optimization for metrology or test systems.
• Knowledge of quality systems, measurement documentation, and standardization of metrology methods.
• Experience working with suppliers, vendors, or external calibration/measurement service providers.
• Demonstrated ability to analyze measurement data using statistical methods to identify variation, correlation issues, tool drift, and root causes.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

• Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD. The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence.

Intel Responsibilities

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during your hiring process, please report this immediately to your recruiter.

Job Type

Experienced Hire Shift: Shift 1 (United States of America)

Primary Location

US, Arizona, Phoenix