Senior Advanced Packaging Defect Inspection Engineer

Intel Corporation; Hillsboro (OR); On-site; USD 115,000 - 220,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health, retirement, and vacation benef

Job summary

Intel Corporation's Advanced Packaging Technology Development Metrology Group in Hillsboro, Oregon seeks a Senior Module Development Engineer to lead next-generation metrology equipment development and end-to-end qualification from installation to fab readiness.

You will work across cross-functional teams, define roadmaps, collaborate with AI and advanced process control groups, and translate industry trends into concrete capabilities that keep Intel ahead of program demand.

Qualifications

• Bachelor's degree with 4+ years of relevant experience, or advanced degree with required years.
• Experience in semiconductor processing, wafer-level assembly, or cleanroom environments.
• Proficiency in process development methodologies and SPC.
• Technical expertise in module engineering or fab process/hardware development.
• Strong collaboration and data-analysis abilities for optimization.

Responsibilities

• Lead metrology technology development across high-volume and future nodes.
• Design and develop metrology/inspection processes and system configurations.
• Define long-range metrology roadmaps aligned with industry trends.
• Conduct feasibility studies and early assessments of new measurement approaches.
• Qualify end-to-end metrology equipment from install to fab readiness.
• Serve as primary technical resource for fab support and tool performance.
• Partner with suppliers to co-develop enabling tool capabilities.
• Collaborate with AI/APC teams to create predictive process controls.
• Present readiness and risk status to senior leadership.

Skills

Semiconductor processing

Wafer-level assembly

Statistical process control

Process development

Data analysis

Packaging processes

Equipment automation

Project management

Python scripting

Education

Bachelor's degree in STEM fields

Master's degree or PhD in related fields

Tools

Scripting tools (Python)

Metrology equipment collaboration

Job description

Job Details: Job Description: The Advanced Packaging Technology Development (APTD) Metrology Group at Intel sits at the heart of our most critical technology development and pathfinding programs. As packaging architectures grow increasingly complex, the role of metrology has evolved far beyond traditional inspection and measurement — it has become a strategic enabler of technology progress, yield learning, and program decision-making confidence. We are seeking a Senior Module Development Engineer who combines deep hands‑on expertise in next‑generation metrology equipment with a broad, current awareness of where the semiconductor metrology industry is heading. The ideal candidate brings the technical credibility to work at the equipment level and the strategic clarity to translate industry knowledge into a forward‑looking roadmap that keeps our capabilities ahead of program demand. This requires genuine engagement with the global metrology landscape — staying current with advances in measurement science, emerging equipment capabilities, and evolving industry standards — and applying that knowledge with sound judgment and determine which capabilities are worth pursuing and when. This engineer will be embedded in our most advanced development and pathfinding programs from their earliest stages — ensuring that measurement strategies are defined, equipment is ready, and metrology coverage is in place before process flows are locked and before gaps can become program risks. A critical dimension of this role is the end‑to‑end qualification of new metrology equipment — taking ownership from initial tool installation and acceptance testing through process validation and full fab readiness — ensuring every new tool meets the performance and capability standards our programs require. This engineer will also serve as a key technical resource for fab support, and ensuring the metrology tool fleet consistently operates at the highest level of performance and availability. The ability to move fluidly between strategic roadmap work and hands‑on fab problem solving is essential — and is what makes this role both uniquely challenging and uniquely rewarding. This is a role that demands technical depth, industry awareness, and the ability to lead with influence across a wide range of partners — from process integration and module engineering to advanced process control, AI and automation, and senior program leadership. The ideal candidate resolves complex process challenges with the same confidence and credibility they bring to presenting a technology investment case to senior leadership.

Key Responsibilities:

• Drive technology development and enablement across both high‑volume manufacturing and future technology nodes — delivering process integration and equipment solutions that meet desired device specifications and performance targets
• Lead the design and development of technically sophisticated metrology and inspection processes including material selection, parameter optimization, equipment configuration, and system design to enable new product architectures and functional requirements
• Define and own the metrology group's long‑range technology roadmap translating a deep understanding of industry trends, emerging measurement technologies, and program requirements into a clear, prioritized strategy that keeps our capabilities ahead of demand
• Perform pathfinding activities in support of process and hardware development enabling the manufacturing of innovative device architectures and developing roadmaps for technologies that support future program needs.
• Conduct process technology feasibility studies through theoretical simulations and practical engineering methods providing early, evidence‑based assessments of new measurement approaches before committing to full qualification
• Evaluate and qualify next‑generation metrology and inspection equipment end‑to‑end — from installation and acceptance testing through process validation and full fab readiness — ensuring every new tool meets the performance and capability standards our programs require.
• Serve as the primary technical resource for fab support — providing engineering disposition on process excursions, driving resolution of metrology‑related program holds, and maintaining the tool fleet at the highest level of performance and availability.
• Recommend and implement equipment and process modifications that improve production efficiency, optimize output, and enhance manufacturing techniques for both existing and next‑generation products.
• Partner with key equipment and materials suppliers to develop and implement enabling elements of the technology — building direct technical relationships that go beyond standard supplier engagement to actively co‑shape next‑generation tool capabilities and roadmaps.
• Remain current on relevant industry process, materials, and metrology trends — developing a forward‑looking view of future technology needs and partnering with the vendor ecosystem to build a cost‑sensitive, capability‑driven roadmap that pushes the industry forward.
• Lead metrology module development across multiple concurrent advanced packaging programs — taking full ownership from first wafer through process sign‑off, including recipe development, specification setting, SPC strategy, and sampling plan definition.
• Design and implement rapid inline feedback mechanisms that compress the time between experiment execution and actionable insight — directly accelerating cycles of learning across TD and pathfinding programs.
• Collaborate with AI, machine learning, and advanced process control teams to develop intelligent monitoring and excursion detection strategies — evolving from threshold‑based alarms toward predictive, context‑aware process control.
• Represent the metrology group in cross‑functional program reviews — communicating metrology readiness, capability status, and risk with clarity and credibility to integration, process, and senior program leadership teams.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience.

Minimum Qualifications Bachelor's degree in materials science, electrical engineering, mechanical engineering, chemical engineering, physics, chemistry, or related STEM field with 4+ years of relevant experience. OR master’s degree in the same fields with 2+ years of relevant experience. OR PhD in the same fields.

Relevant experience in any of the following: Expertise in semiconductor processing, wafer‑level assembly, or cleanroom environments. Proficiency in process development methodologies, statistical process control, and manufacturing process improvement. Technical expertise in module engineering or fab process/hardware technology development.

Preferred Qualifications PhD and 3+ years of experience in relevant field and any of the below: Strong metrology fundamental understanding and development experience. Strong collaboration skills with cross‑functional teams, including yield and operations. Demonstrated skills to leverage data analysis tools for process optimization and continuous improvement. Experience with packaging processes, equipment automation development, or project management. Passionate about advancing Intel's strategic goals and driving meaningful industry advancements. Experience in Python, Dashboard Creation, and Scripting Direct experience engaging with metrology equipment vendors at a technical roadmap level as a co‑development partner.

Job Type: Experienced Hire

Shift: Shift 1 (United States of America)

Primary Location: US, Oregon, Hillsboro

Additional Locations:

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust N/A

Benefits

We offer a total compensation package that ranks among the best in the industry.

• competitive pay
• stock bonuses
• benefit programs which include health, retirement, and vacation
• Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job‑related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on‑site presence. * Job posting details (such as work model, location or time type) are subject to change.