3D Physical Design Engineer for AI/TPU Hardware

Google; Sunnyvale (CA); Vor Ort; USD 117.000 - 197.000; Vollzeit

Zusammenfassung

Google is seeking a Physical Design Engineer, 3D Technology, to shape the future of AI/ML hardware acceleration. You will contribute to TPU architecture and its integration within AI/ML systems, collaborating with HW teams to push 3D integration boundaries and deliver high-performance ASIC/SoC designs.

You will drive 3D physical design methodologies, optimize across digital blocks, and participate in tapeout readiness, enabling Google's TPU innovations at scale.

Qualifikationen

• Bachelor's degree or equivalent practical experience in EE/CE/CS.
• 4 years in physical design and 3D integration tech (3D-IC, 2.5D, TSV).
• Experience with industry standard chip design tools (Synopsys, Cadence, Siemens EDA/Mentor).

Aufgaben

• Drive development of a leading edge 3D technology platform for ASICs/SoCs from design to test.
• Optimize digital blocks for performance, power, and area using physical design methods.
• Define methodologies by evaluating performance, power, and area across nodes.
• Collaborate with physical design, technology, circuits, and architecture teams and IP partners.
• Design and build custom transistor/gate-level circuits to support floorplanning.

Kenntnisse

3D integration

Physical design

Hardware architecture

VLSI design

Ausbildung

Bachelor's degree in Electrical/Computer Engineering or Computer Science

Tools

Synopsys

Cadence

Mentor Graphics

Jobbeschreibung

Google is seeking a Physical Design Engineer, 3D Technology, to shape the future of AI/ML hardware acceleration. You will contribute to TPU architecture and its integration within AI/ML systems, collaborating with HW teams to push 3D integration boundaries and deliver high-performance ASIC/SoC designs.

You will drive 3D physical design methodologies, optimize across digital blocks, and participate in tapeout readiness, enabling Google's TPU innovations at scale.