3D Packaging Engineer - Advanced Packaging Innovator

Advanced Micro Devices; Austin (TX); On-site; USD 120,000 - 170,000; Full time

Job summary

Advanced Micro Devices in Austin, TX, seeks an experienced Advanced Packaging Engineer to drive technology development of 3D package architectures. You will execute proof of concept, bring up products, and improve yield and reliability to meet performance and cost goals.

The candidate should have hands‑on BEOL/TSV and Hybrid bonding experience, strong design/reliability skills, and excellence in communication with partners and stakeholders. This role is hybrid and visa‑not‑sponsored.

Qualifications

• Experience with BEOL process, TSV integration and Hybrid bonding.
• Strong knowledge in design and reliability concepts (TV design, CPI, thermo‑mechanical analysis, DFR).
• Proficiency in advanced packaging techniques (fan‑out, 3D stacking, 2.5D, MCM).
• Industry experience with strong problem solving and communication skills.

Responsibilities

• Drive/participate in defining FMEA, TV Design, DFM, and DFY; manage DOE plans and execute material/process validation; define quality and reliability tests.
• Partner with AMD architects, designers, and product owners to develop high yielding, cost‑effective solutions and transfer into high‑volume manufacturing.
• Enable development partners to bring up new packaging technology/process from concept to NPI and prototyping to mass production.

Skills

BEOL integration

TSV integration

Hybrid bonding

Design & reliability

Packaging techniques

Communication & presentation

Education

M.S./Ph.D. in materials, mechanical, chemical, or electrical engineering

Job description

Advanced Micro Devices in Austin, TX, seeks an experienced Advanced Packaging Engineer to drive technology development of 3D package architectures. You will execute proof of concept, bring up products, and improve yield and reliability to meet performance and cost goals.

The candidate should have hands‑on BEOL/TSV and Hybrid bonding experience, strong design/reliability skills, and excellence in communication with partners and stakeholders. This role is hybrid and visa‑not‑sponsored.